Inventor · disambiguated record
Guleid Hussen
Also filed as: HUSSEN GULEID · HUSSEN GULEID NUR ABDI
9 granted patents·12 pending applications·3 citations·filing 2007–2024
78Inventor score
Files withWATLOW ELECTRIC MFG10THINSILICON CORP5THINSILICION CORP3COMPONENT RE ENG COMPANY INC1STEPHENS JASON MICHAEL1
Top patents by PatentIndex Score
21 records- 0178US12128494B2Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2023·Granted Oct 29, 2024·0 cites·13 claims
- 0278US2025050439A1Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 0373US11993547B2Termination feedthrough unit with ceramic insulator for vacuum and corrosive applicationsWATLOW ELECTRIC MFG·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 0469US12020971B2Method for joining quartz pieces and quartz electrodes and other devices of joined quartzWATLOW ELECTRIC MFG·Filed 2021·Granted Jun 25, 2024·0 cites·15 claims
- 0569US10593584B2Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Mar 17, 2020·1 cites·27 claims
- 0662US2025069943A1Hybrid shaft assembly for thermal control in heated semiconductor pedestalsWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 0761US11222804B2Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameWATLOW ELECTRIC MFG·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 0861US2024404869A1Solid-state bonding method for the manufacture of semiconductor chucks and heatersWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 0960US11648620B2Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2018·Granted May 16, 2023·0 cites·13 claims
- 1058US8444766B2System and method for recycling a gas used to deposit a semiconductor layerSTEPHENS JASON MICHAEL·Filed 2009·Granted May 21, 2013·2 cites·18 claims
- 1158US2011189811A1Photovoltaic device and method of manufacturing photovoltaic devicesTHINSILICON CORP·Filed 2011·Application pending·0 cites
- 1257US11183412B2Method for joining quartz pieces and quartz electrodes and other devices of joined quartzWATLOW ELECTRIC MFG·Filed 2018·Granted Nov 23, 2021·0 cites·20 claims
- 1356US2013295710A1Photovoltaic modules and methods for manufacturing photovoltaic modules having tandem semiconductor layer stacksTHIN SILICON CORP·Filed 2013·Application pending·0 cites
- 1455US2008295882A1Photovoltaic device and method of manufacturing photovoltaic devicesTHINSILICON CORP·Filed 2008·Application pending·0 cites
- 1554US2010313952A1Photovoltaic modules and methods of manufacturing photovoltaic modules having multiple semiconductor layer stacksTHINSILICION CORP·Filed 2010·Application pending·0 cites
- 1654US2010313942A1Photovoltaic module and method of manufacturing a photovoltaic module having multiple semiconductor layer stacksTHINSILICION CORP·Filed 2010·Application pending·0 cites
- 1754US2010313935A1Photovoltaic modules and methods for manufacturing photovoltaic modules having tandem semiconductor layer stacksTHINSILICION CORP·Filed 2010·Application pending·0 cites
- 1849US11028021B2Termination feedthrough unit with ceramic insulator suitable for vacuum and corrosive applicationsWATLOW ELECTRIC MFG·Filed 2018·Granted Jun 8, 2021·0 cites·16 claims
- 1949US2011114156A1Photovoltaic modules having a built-in bypass diode and methods for manufacturing photovoltaic modules having a built-in bypass diodeTHINSILICON CORP·Filed 2010·Application pending·0 cites
- 2048US2013014800A1Photovoltaic device and method for scribing a photovoltaic deviceTHINSILICON CORP·Filed 2011·Application pending·0 cites
- 2147US2008072953A1Back contact device for photovoltaic cells and method of manufacturing a back contact deviceTHINSILICON CORP·Filed 2007·Application pending·0 cites
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