Inventor · disambiguated record
Azlina Kassim
Also filed as: KASSIM AZLINA
6 granted patents·2 pending applications·2 citations·filing 2018–2024
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0167US12080625B2Semiconductor package with releasable isolation layer protectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Sep 3, 2024·0 cites·11 claims
- 0267US11069600B2Semiconductor package with space efficient lead and die pad designINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 20, 2021·1 cites·16 claims
- 0363US10840172B2Leadframe, semiconductor package including a leadframe and method for forming a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 17, 2020·1 cites·15 claims
- 0457US11791238B2Semiconductor package with releasable isolation layer protectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Oct 17, 2023·0 cites·9 claims
- 0556US2025201754A1Semiconductor device comprising a carrier, a semiconductor die and a c-shaped clip connected between themINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0656US2024312936A1Power semiconductor package including a passive electronic component and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0754US12512380B2Semiconductor packages including a package body with grooves formed thereinINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0848US12057376B2Three level interconnect clipINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 6, 2024·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →