Inventor · disambiguated record
Byoung Do Lee
Also filed as: LEE BYOUNG DO
5 granted patents·19 citations·filing 2010–2013
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0180US9390997B2Semiconductor chip and stacked type semiconductor package having the sameSK HYNIX INC·Filed 2013·Granted Jul 12, 2016·6 cites·10 claims
- 0279US8680688B2Stack package having flexible conductorsKANG TAE MIN·Filed 2012·Granted Mar 25, 2014·5 cites·20 claims
- 0378US8288873B2Stack package having flexible conductorsKANG TAE MIN·Filed 2010·Granted Oct 16, 2012·5 cites·16 claims
- 0466US8810309B2Stack package and method for selecting chip in stack packageLEE DAE WOONG·Filed 2011·Granted Aug 19, 2014·3 cites·5 claims
- 0536US8164200B2Stack semiconductor package and method for manufacturing the sameKANG TAE MIN·Filed 2010·Granted Apr 24, 2012·0 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →