Inventor · disambiguated record
Nicholas J. Salatino
Also filed as: SALATINO NICHOLAS J
3 granted patents·1 pending application·257 citations·filing 2000–2009
76Inventor score
Top patents by PatentIndex Score
4 records- 0195US8129258B2Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor waferHOSIER PAUL A·Filed 2009·Granted Mar 6, 2012·182 cites·14 claims
- 0282US6291317B1Method for dicing of micro devicesXEROX CORP·Filed 2000·Granted Sep 18, 2001·70 cites·29 claims
- 0358US6955989B2Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in siliconXEROX CORP·Filed 2001·Granted Oct 18, 2005·5 cites·17 claims
- 0447US2005221585A1Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in siliconXEROX CORP·Filed 2005·Application pending·0 cites
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