Inventor · disambiguated record
Maurice Othieno
Also filed as: OTHIENO MAURICE · OTHIENO MAURICE O
15 granted patents·190 citations·filing 2002–2010
92Inventor score
Top patents by PatentIndex Score
15 records- 0183US8163643B1Enhanced pad design for solder attach devicesOTHIENO MAURICE O·Filed 2010·Granted Apr 24, 2012·12 cites·20 claims
- 0282US6933602B1Semiconductor package having a thermally and electrically connected heatspreaderLSI LOGIC CORP·Filed 2003·Granted Aug 23, 2005·38 cites·12 claims
- 0382US6654248B1Top gated heat dissipationLSI LOGIC CORP·Filed 2002·Granted Nov 25, 2003·39 cites·10 claims
- 0481US7420809B2Heat spreader in integrated circuit packageLSI CORP·Filed 2004·Granted Sep 2, 2008·33 cites·15 claims
- 0579US6867480B2Electromagnetic interference package protectionLSI LOGIC CORP·Filed 2003·Granted Mar 15, 2005·29 cites·20 claims
- 0670US6825563B1Slotted bonding padLSI LOGIC CORP·Filed 2003·Granted Nov 30, 2004·17 cites·20 claims
- 0764US7646091B2Semiconductor package and method using isolated Vss plane to accommodate high speed circuitry ground isolationLSI CORP·Filed 2006·Granted Jan 12, 2010·3 cites·14 claims
- 0858US7327043B2Two layer substrate ball grid array designLSI LOGIC CORP·Filed 2005·Granted Feb 5, 2008·2 cites·12 claims
- 0955US8129759B2Semiconductor package and method using isolated VSS plane to accommodate high speed circuitry ground isolationOTHIENO MAURICE O·Filed 2009·Granted Mar 6, 2012·1 cites·15 claims
- 1055US7804167B2Wire bond integrated circuit package for high speed I/OLSI LOGIC CORP·Filed 2006·Granted Sep 28, 2010·1 cites·17 claims
- 1155US6603201B1Electronic substrateLSI LOGIC CORP·Filed 2002·Granted Aug 5, 2003·6 cites·16 claims
- 1253US7235889B2Integrated heatspreader for use in wire bonded ball grid array semiconductor packagesLSI CORP·Filed 2004·Granted Jun 26, 2007·6 cites·11 claims
- 1345US7436060B2Semiconductor package and process utilizing pre-formed mold cap and heatspreader assemblyLSI CORP·Filed 2004·Granted Oct 14, 2008·2 cites·14 claims
- 1440US6777803B2Solder mask on bonding ringLSI LOGIC CORP·Filed 2002·Granted Aug 17, 2004·1 cites·20 claims
- 1538US6801437B2Electronic organic substrateLSI LOGIC CORP·Filed 2003·Granted Oct 5, 2004·0 cites·18 claims
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