Inventor · disambiguated record
Elah Bozorg-Grayeli
Also filed as: BOZORG-GRAYELI ELAH
13 granted patents·4 pending applications·2 citations·filing 2015–2024
81Inventor score
Files withINTEL CORP17
Top patents by PatentIndex Score
17 records- 0187US11935808B2IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted Mar 19, 2024·2 cites·22 claims
- 0276US12283535B2IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnectsINTEL CORP·Filed 2023·Granted Apr 22, 2025·0 cites·14 claims
- 0360US2025309008A1Solder thermal interface core attached with low-temperature solder paste for microelectronic devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0455US2025106983A1Stiffener architectures for glass edge protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 0554US11984377B2IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted May 14, 2024·0 cites·25 claims
- 0652US11881438B2First-level integration of second-level thermal interface material for integrated circuit assembliesINTEL CORP·Filed 2020·Granted Jan 23, 2024·0 cites·18 claims
- 0751US2024222288A1Socket interface frames for devices with improved-performance substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 0850US11923267B2IC die with solderable thermal interface structures for assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted Mar 5, 2024·0 cites·16 claims
- 0949US11881440B2Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bondsINTEL CORP·Filed 2020·Granted Jan 23, 2024·0 cites·18 claims
- 1049US2022199489A1Gallium alloys as fillers for polymer thermal interface materialsINTEL CORP·Filed 2021·Application pending·0 cites
- 1148US11710672B2Microelectronic package with underfilled sealantINTEL CORP·Filed 2019·Granted Jul 25, 2023·0 cites·20 claims
- 1247US11869824B2Thermal interface structures for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 9, 2024·0 cites·25 claims
- 1346US11935799B2Integrated circuit package lids with polymer featuresINTEL CORP·Filed 2019·Granted Mar 19, 2024·0 cites·18 claims
- 1446US11710677B2Ultraviolet (UV)-curable sealant in a microelectronic packageINTEL CORP·Filed 2019·Granted Jul 25, 2023·0 cites·19 claims
- 1541US11004768B2Multi-chip package with partial integrated heat spreaderINTEL CORP·Filed 2019·Granted May 11, 2021·0 cites·15 claims
- 1635US10569298B2Substrate with epoxy cured by ultraviolet laserINTEL CORP·Filed 2017·Granted Feb 25, 2020·0 cites·22 claims
- 1733US10475715B2Two material high K thermal encapsulant systemINTEL CORP·Filed 2015·Granted Nov 12, 2019·0 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →