Inventor · disambiguated record
Jyun-Liang Wu
Also filed as: WU JYUN-LIANG
2 granted patents·1 pending application·2 citations·filing 2016–2016
35Inventor score
Files withXINTEC INC3
Top patents by PatentIndex Score
3 records- 0175US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 0240US9875912B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Jan 23, 2018·0 cites·16 claims
- 0333US2017110495A1Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →