Inventor · disambiguated record
Gyu Jei Lee
Also filed as: LEE GYU JEI
5 granted patents·2 pending applications·6 citations·filing 2012–2023
67Inventor score
Top patents by PatentIndex Score
7 records- 0177US8829657B2Semiconductor substrate, semiconductor chip having the same, and stacked semiconductor packageKIM HYUN JOO·Filed 2012·Granted Sep 9, 2014·5 cites·14 claims
- 0258US2025022869A1Methods of manufacturing semiconductor die stack structuresSK HYNIX INC·Filed 2023·Application pending·0 cites
- 0354US8878349B2Semiconductor chip and stacked semiconductor package having the sameLEE GYU JEI·Filed 2012·Granted Nov 4, 2014·1 cites·19 claims
- 0449US10393646B2Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the sameSK HYNIX INC·Filed 2018·Granted Aug 27, 2019·0 cites·9 claims
- 0546US11569216B2Semiconductor package including stacked semiconductor chips and method for fabricating the semiconductor packageSK HYNIX INC·Filed 2021·Granted Jan 31, 2023·0 cites·22 claims
- 0646US9945772B2Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the sameSK HYNIX INC·Filed 2016·Granted Apr 17, 2018·0 cites·18 claims
- 0738US2013240885A1Semiconductor substrate, and semiconductor chip and stacked semiconductor package having the sameKIM HYUN JOO·Filed 2012·Application pending·0 cites
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