Inventor · disambiguated record
Young-Rae Park
Also filed as: PARK YOUNG-RAE
11 granted patents·3 pending applications·129 citations·filing 2001–2022
90Inventor score
Top patents by PatentIndex Score
14 records- 0192US6626968B2Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 30, 2003·53 cites·27 claims
- 0278US7196010B2Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 27, 2007·16 cites·34 claims
- 0372US6585570B2Method and apparatus for supplying chemical-mechanical polishing slurriesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jul 1, 2003·15 cites·13 claims
- 0470US6695684B2Chemical mechanical polishing apparatus having a cleaner for cleaning a conditioning disc and method of conditioning a polishing pad of the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 24, 2004·15 cites·9 claims
- 0558US6858452B2Method for isolating self-aligned contact padsSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 22, 2005·6 cites·16 claims
- 0658US6548388B2Semiconductor device including gate electrode having damascene structure and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 15, 2003·9 cites·18 claims
- 0755US7244649B2Method of manufacturing a capacitor having improved capacitance and method of manufacturing a semiconductor device including the capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 17, 2007·5 cites·22 claims
- 0853US2007155178A1Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0952US6716732B2Method for fabricating a contact pad of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 6, 2004·5 cites·20 claims
- 1049US6498102B2Method for planarizing a semiconductor device using ceria-based slurrySAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 24, 2002·2 cites·16 claims
- 1146US6518157B2Methods of planarizing insulating layers on regions having different etching ratesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 11, 2003·3 cites·29 claims
- 1240US12194800B2Driving module of autonomous mobile robotROBOTIS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·7 claims
- 1339US2005014330A1Method of planarizing an interlayer dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 1436US2005272218A1Method of forming metal lower electrode of a capacitor and method of selectively etching a metal layer for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
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