Inventor · disambiguated record
Chun-An Huang
Also filed as: HUANG CHUN-AN
7 granted patents·1 pending application·16 citations·filing 2010–2015
78Inventor score
Top patents by PatentIndex Score
8 records- 0185US9133021B2Wafer level package having a pressure sensor and fabrication method thereofCHANG HONG-DA·Filed 2011·Granted Sep 15, 2015·9 cites·8 claims
- 0274US8610272B2Package structure with micro-electromechanical element and manufacturing method thereofHUANG CHUN-AN·Filed 2010·Granted Dec 17, 2013·4 cites·7 claims
- 0367US8198689B2Package structure having micro-electromechanical element and fabrication method thereofCHAN CHANG-YUEH·Filed 2010·Granted Jun 12, 2012·2 cites·9 claims
- 0465US9487393B2Fabrication method of wafer level package having a pressure sensorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Nov 8, 2016·1 cites·8 claims
- 0552US8741693B2Method for manufacturing package structure with micro-electromechanical elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jun 3, 2014·0 cites·13 claims
- 0650US8564115B2Package structure having micro-electromechanical elementCHAN CHANG-YUEH·Filed 2012·Granted Oct 22, 2013·0 cites·8 claims
- 0736US2013020709A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 0834US8288189B2Package structure having MEMS element and fabrication method thereofHUANG CHUN-AN·Filed 2010·Granted Oct 16, 2012·0 cites·19 claims
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