Inventor · disambiguated record
Hong Wei Wang
Also filed as: WANG HONG · WANG HONG W · WANG HONG-WEI
8 granted patents·6 pending applications·51 citations·filing 1989–2020
83Inventor score
Top patents by PatentIndex Score
14 records- 0196US10583790B2Adjustable electronic device mountWANG HONG·Filed 2016·Granted Mar 10, 2020·24 cites·12 claims
- 0265US9273131B2Anti-bFGF humanized double-stranded antibody with stable disulfide bond, preparation method and application thereofDENG NING·Filed 2012·Granted Mar 1, 2016·2 cites·6 claims
- 0361US8340137B2Segmented and overlapped skew tracking method for SERDES frame interface level 5CHEN LIANG·Filed 2010·Granted Dec 25, 2012·2 cites·20 claims
- 0460US8606991B2Method and system for refreshing dynamic random access memorySUN XU GUANG·Filed 2010·Granted Dec 10, 2013·4 cites·12 claims
- 0559US5004555AHeat cycle treatment for improving the performance of piezoelectric ceramicsIND TECH RES INST·Filed 1989·Granted Apr 2, 1991·15 cites·10 claims
- 0647US7521533B2Tryptase polypeptide and uses thereofHUNT JOHN E·Filed 2003·Granted Apr 21, 2009·0 cites·1 claims
- 0746US2023184624A1Fault Diagnosis Method and Apparatus ThereforSIEMENS AG·Filed 2020·Application pending·0 cites
- 0843US2013012357A1Fitness equipment incorporated with content control of an electronic deviceWANG HONG-WEI·Filed 2012·Application pending·0 cites
- 0942US9455050B2Failure diagnosis circuitST MICROELECTRONICS SRL·Filed 2015·Granted Sep 27, 2016·0 cites·16 claims
- 1040US2014331891A1Railway wagon bogie and axle box rubber spring thereofZHUZHOU TIMES NEW MATERIAL TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1139US7145315B2Over-current detection circuit in a switch regulatorBROADCOM CORP·Filed 2004·Granted Dec 5, 2006·4 cites·24 claims
- 1239US2017220158A1Touch Display Substrate, Touch Display Panel, Touch Display Screen and Electronic DeviceBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Application pending·0 cites
- 1335US2018011588A1Driving method and device and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Application pending·0 cites
- 1434US2014242407A1In-situ Compressed Specimen for Evaluating Mechanical Property of Copper Interconnection Micro Column and Preparation Method thereofWANG HONG·Filed 2013·Application pending·0 cites
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