Inventor · disambiguated record
Remy J. Chelini
Also filed as: CHELINI REMY J
8 granted patents·4 pending applications·101 citations·filing 2003–2010
87Inventor score
Top patents by PatentIndex Score
12 records- 0189US7745281B2Thin solid electrolytic capacitor embeddable in a substrateKEMET ELECTRONICS CORP·Filed 2008·Granted Jun 29, 2010·20 cites·60 claims
- 0283US7361568B2Embedded capacitors and methods for their fabrication and connectionMOTOROLA INC·Filed 2005·Granted Apr 22, 2008·12 cites·5 claims
- 0382US7078796B2Corrosion-resistant copper bond pad and integrated deviceFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 18, 2006·41 cites·27 claims
- 0477US7444727B2Method for forming multi-layer embedded capacitors on a printed circuit boardMOTOROLA INC·Filed 2006·Granted Nov 4, 2008·7 cites·9 claims
- 0567US7241510B2Peelable circuit board foilMOTOROLA INC·Filed 2005·Granted Jul 10, 2007·3 cites·12 claims
- 0667US7038571B2Polymer thick film resistor, layout cell, and methodMOTOROLA INC·Filed 2003·Granted May 2, 2006·12 cites·4 claims
- 0755US7833292B2Channel method for forming a capacitorKEMET ELECTRONICS CORP·Filed 2008·Granted Nov 16, 2010·1 cites·76 claims
- 0853US6872468B1Peelable circuit board foilMOTOROLA INC·Filed 2003·Granted Mar 29, 2005·5 cites·11 claims
- 0949US2010177460A1Channel method for forming a capacitorBRENNEMAN KEITH R·Filed 2010·Application pending·0 cites
- 1039US2008160851A1Textiles Having a High Impedance SurfaceMOTOROLA INC·Filed 2006·Application pending·0 cites
- 1137US2005104207A1Corrosion-resistant bond pad and integrated deviceFiled 2004·Application pending·0 cites
- 1237US2005001316A1Corrosion-resistant bond pad and integrated deviceMOTOROLA INC·Filed 2003·Application pending·0 cites
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