Inventor · disambiguated record
Guido Albermann
Also filed as: ALBERMANN GUIDO
11 granted patents·2 pending applications·37 citations·filing 2008–2022
85Inventor score
Top patents by PatentIndex Score
13 records- 0193US9847258B2Plasma dicing with blade saw patterned underside maskNXP BV·Filed 2015·Granted Dec 19, 2017·16 cites·14 claims
- 0286US8809166B2High die strength semiconductor wafer processing method and systemNXP BV·Filed 2012·Granted Aug 19, 2014·9 cites·9 claims
- 0384US9601437B2Plasma etching and stealth dicing laser processNXP BV·Filed 2014·Granted Mar 21, 2017·7 cites·19 claims
- 0471US11881425B2Technique for handling diced wafers of integrated circuitsNXP BV·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 0569US8895363B2Die preparation for wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Nov 25, 2014·3 cites·6 claims
- 0662US9812361B2Combination grinding after laser (GAL) and laser on-off function to increase die strengthNXP BV·Filed 2014·Granted Nov 7, 2017·1 cites·15 claims
- 0759US11508606B2Technique for handling diced wafers of integrated circuitsNXP BV·Filed 2019·Granted Nov 22, 2022·0 cites·11 claims
- 0853US8415769B2Integrated circuits on a wafer and method for separating integrated circuits on a waferSCHEUCHER HEIMO·Filed 2008·Granted Apr 9, 2013·1 cites·17 claims
- 0948US10896878B2Integrated circuit saw bow break pointNXP BV·Filed 2019·Granted Jan 19, 2021·0 cites·15 claims
- 1044US9349645B2Apparatus, device and method for wafer dicingNXP BV·Filed 2013·Granted May 24, 2016·0 cites·13 claims
- 1143US2016172243A1Wafer material removalNXP BV·Filed 2014·Application pending·0 cites
- 1240US10347534B2Variable stealth laser dicing processNXP BV·Filed 2017·Granted Jul 9, 2019·0 cites·16 claims
- 1340US2021305095A1Method for forming a packaged semiconductor deviceNXP BV·Filed 2020·Application pending·0 cites
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