Inventor · disambiguated record
Youdong Jiang
Also filed as: JIANG YOUDONG
1 granted patent·2 pending applications·0 citations·filing 2021–2025
14Inventor score
Technology areasH10W
Files withYANGTZE MEMORY TECH CO LTD3
Top patents by PatentIndex Score
3 records- 0176US2025349601A1Wafer bonding method and bonded waferYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0276US2025349602A1Wafer bonding method and bonded waferYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0363US12381111B2Wafer bonding method and bonded waferYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 5, 2025·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →