Inventor · disambiguated record
Sen-Bor Jan
Also filed as: JAN SEN · JAN SEN-BOR
46 granted patents·11 pending applications·498 citations·filing 2006–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD49CHEN MING-FA3TAIWAN SEMICONDUCTOR MFG3SPI ELECTRONIC CO LTD2
Top patents by PatentIndex Score
57 records- 0198US11728247B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·4 cites·14 claims
- 0298US11342297B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 0398US8803292B2Through-substrate vias and methods for forming the sameCHEN MING-FA·Filed 2012·Granted Aug 12, 2014·383 cites·8 claims
- 0497US11735536B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·3 cites·20 claims
- 0597US10312201B1Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 4, 2019·20 cites·20 claims
- 0696US11309243B2Package having different metal densities in different regions and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
- 0796US11080455B1Layout design of integrated circuit with through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 3, 2021·4 cites·20 claims
- 0895US11482499B2Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·3 cites·20 claims
- 0994US12223250B2Method of manufacturing integrated circuit having through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·2 cites·20 claims
- 1094US11094613B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·8 cites·20 claims
- 1194US8624324B1Connecting through vias to devicesCHEN MING-FA·Filed 2012·Granted Jan 7, 2014·16 cites·20 claims
- 1293US10510701B2Semiconductor die connection system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·5 cites·20 claims
- 1392US11748544B2Method of manufacturing integrated circuit having through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·8 claims
- 1492US11107779B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·5 cites·20 claims
- 1591US9520340B2Semiconductor die connection system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 13, 2016·4 cites·20 claims
- 1690US10741506B2Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 11, 2020·4 cites·20 claims
- 1790US8518796B2Semiconductor die connection system and methodCHEN MING-FA·Filed 2012·Granted Aug 27, 2013·6 cites·20 claims
- 1889US11387205B2Semiconductor die connection system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 12, 2022·2 cites·20 claims
- 1988US10515874B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
- 2088US10504776B2Methods for forming through-substrate vias penetrating inter-layer dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·4 cites·20 claims
- 2188US9153540B2Semiconductor die connection system and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·4 cites·20 claims
- 2287US12218093B2Semiconductor die connection system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 2387US9355935B2Connecting through vias to devicesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 31, 2016·4 cites·20 claims
- 2484US12362261B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 2583US12476206B2Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2683US12113036B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2783US11855029B2Semiconductor die connection system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2883US2024371801A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2982US11410929B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 9, 2022·2 cites·20 claims
- 3082US2024387377A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3182US2024386183A1Through-silicon vias in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3281US12165971B2Package having different metal densities in different regions and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 3381US2025174591A1Semiconductor Die Connection System and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3480US12223252B2Through-silicon via in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 3580US2024371815A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3679US12080629B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 3779US11791243B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 3879US11756901B2Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 3979US2024105619A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4078US12074131B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 4178US10930580B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·1 cites·20 claims
- 4277US11923302B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 4377US2024418932A1Photonic silicon spatial beam transformer integrated on 3dic package and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4477US2025336889A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4575US11916031B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 4675US11769724B2Package having different metal densities in different regions and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 4774US11462458B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 4, 2022·0 cites·20 claims
- 4873US11586797B2Through-silicon vias in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 4972US12124078B2Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 5072US10784219B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·20 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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