Inventor · disambiguated record
Hellmut Ahne
Also filed as: AHNE HELLMUT
61 granted patents·1,344 citations·filing 1980–1997
99Inventor score
Top patents by PatentIndex Score
61 records- 0197US5234793AMethod for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after developmentSIEMENS AG·Filed 1990·Granted Aug 10, 1993·144 cites·20 claims
- 0297US4339521AHeat resistant positive resists containing polyoxazolesSIEMENS AG·Filed 1980·Granted Jul 13, 1982·121 cites·7 claims
- 0396US4395482AMethod for the preparation of heat-resistant relief structures using positive resistsSIEMENS AG·Filed 1982·Granted Jul 26, 1983·86 cites·7 claims
- 0493US5173393AEtch-resistant deep ultraviolet resist process having an aromatic treating step after developmentSIEMENS AG·Filed 1990·Granted Dec 22, 1992·94 cites·9 claims
- 0592US4329556AN-Azidosulfonylaryl-maleinimidesSIEMENS AG·Filed 1980·Granted May 11, 1982·25 cites·2 claims
- 0690US5250375APhotostructuring processSIEMENS AG·Filed 1991·Granted Oct 5, 1993·66 cites·14 claims
- 0789US5376499AHighly heat-resistant positive resists comprising end-capped hydroxypolyamidesSIEMENS AG·Filed 1992·Granted Dec 27, 1994·61 cites·7 claims
- 0888US4622285AMethod for manufacturing polyoxazole and polythiazole precursorsSIEMENS AG·Filed 1985·Granted Nov 11, 1986·47 cites·7 claims
- 0986US5234794APhotostructuring methodSIEMENS AG·Filed 1992·Granted Aug 10, 1993·50 cites·17 claims
- 1084US4849051AHeat resistant positive resists and method for preparing heat-resistant relief structuresSIEMENS AG·Filed 1988·Granted Jul 18, 1989·50 cites·19 claims
- 1184US4371685ARadiation-reactive precursor stages of highly heat-resistant polymersSIEMENS AG·Filed 1981·Granted Feb 1, 1983·33 cites·17 claims
- 1276US5081000APhotosensitive mixtureSIEMENS AG·Filed 1990·Granted Jan 14, 1992·31 cites·12 claims
- 1372US4311785AMethod for the preparation of highly heat-resistant relief structures and the use thereofSIEMENS AG·Filed 1980·Granted Jan 19, 1982·27 cites·9 claims
- 1470US5556812AConnection and build-up technique for multichip modulesSIEMENS AG·Filed 1995·Granted Sep 17, 1996·40 cites·20 claims
- 1570US4965134AMethod for manufacturing highly heat-resistant dielectricsSIEMENS AG·Filed 1988·Granted Oct 23, 1990·23 cites·18 claims
- 1669US4287294AMethod for the preparation of relief structures by phototechniquesSIEMENS AG·Filed 1980·Granted Sep 1, 1981·24 cites·6 claims
- 1768US4654415AMethod for the preparation of polyimide and polyisoindoloquinazoline dione precursorsSIEMENS AG·Filed 1985·Granted Mar 31, 1987·18 cites·10 claims
- 1868US4590103AMethod for the preparation of thin polyimide filmSIEMENS AG·Filed 1984·Granted May 20, 1986·17 cites·3 claims
- 1965US4883730AMethod for manufacturing heat-stable structured layers based on expoxy resinSIEMENS AG·Filed 1989·Granted Nov 28, 1989·23 cites·18 claims
- 2065US4656244AMethod for the manufacture of polyimidazole and polyimidazopyrrolone precursorsSIEMENS AG·Filed 1985·Granted Apr 7, 1987·11 cites·9 claims
- 2165US4385165APolyimide, polyisoindoloquinazoline dione, polyoxazine dione and polyquinazoline dione precursor stages and the manufactureSIEMENS AG·Filed 1980·Granted May 24, 1983·17 cites·13 claims
- 2264US5922825APreparation of poly-o-hydroxyamides and poly o-mercaptoamidesSIEMENS AG·Filed 1996·Granted Jul 13, 1999·18 cites·4 claims
- 2363US6110637APhotoresists which are suitable for producing sub-micron size structuresSIEMENS AKTINEGESELLSCHAFT·Filed 1995·Granted Aug 29, 2000·22 cites·20 claims
- 2463US5973202APreparation of poly-o-hydroxyamides and poly o-mercaptoamidesSIEMENS AG·Filed 1996·Granted Oct 26, 1999·24 cites·10 claims
- 2560US5883221ASynthesis of polybenzoxasole and polybenzothiazole precursorsSIEMENS AG·Filed 1997·Granted Mar 16, 1999·18 cites·20 claims
- 2657US4828948AMethod for the production of heat-resistant structured layersSIEMENS AG·Filed 1986·Granted May 9, 1989·10 cites·21 claims
- 2755US4598038APreparation of polyimide and polyisoindoloquinazoline dione relief structuresSIEMENS AG·Filed 1985·Granted Jul 1, 1986·9 cites·15 claims
- 2854US5384220AProduction of photolithographic structuresSIEMENS AG·Filed 1991·Granted Jan 24, 1995·16 cites·12 claims
- 2953US4619500AMethod for producing orientation layers for liquid crystal displays and liquid crystal displays having orientation layersSIEMENS AG·Filed 1986·Granted Oct 28, 1986·14 cites·10 claims
- 3052US5262283AMethod for producing a resist structureSIEMENS AG·Filed 1991·Granted Nov 16, 1993·11 cites·20 claims
- 3152US5229258AMethod for producing a resist structureSIEMENS AG·Filed 1991·Granted Jul 20, 1993·11 cites·20 claims
- 3252US5194629AProcess for producing n-tertiary butoxycarbonyl-maleinimideSIEMENS AG·Filed 1991·Granted Mar 16, 1993·4 cites·8 claims
- 3352US4975347AMethod for manufacturing heat-stable structured layers from photopolymers which are addition reaction products of olefinic unsaturated monoisocyanates and phenol-formaldehyde resinsSIEMENS AG·Filed 1990·Granted Dec 4, 1990·15 cites·13 claims
- 3451US4397999APolyimidazole and polyimidazopyrrolone precursor stages and the preparation thereofSIEMENS AG·Filed 1980·Granted Aug 9, 1983·10 cites·5 claims
- 3549US4610947AMethod and manufacturing polyimidazole and polyimidazopyrrolone relief structuresSIEMENS AG·Filed 1985·Granted Sep 9, 1986·7 cites·9 claims
- 3649US4332883AMethod for the manufacture of highly heat-resistant relief structuresSIEMENS AG·Filed 1980·Granted Jun 1, 1982·9 cites·8 claims
- 3748US5726279APreparation of poly-o-hydroxyamides and poly o-mercaptoamidesSIEMENS AG·Filed 1996·Granted Mar 10, 1998·9 cites·4 claims
- 3848US4732951APolyether-based photopolymersSIEMENS AG·Filed 1986·Granted Mar 22, 1988·6 cites·16 claims
- 3947US5783654APreparation of poly-O-hydroxyamides and poly O-mercaptoamidesSIEMENS AG·Filed 1996·Granted Jul 21, 1998·10 cites·10 claims
- 4047US5040090ACapacitive moisture-sensorSIEMENS AG·Filed 1990·Granted Aug 13, 1991·11 cites·13 claims
- 4146US4366230AMethod for the preparation of highly heat-resistant relief structures and the use thereofSIEMENS AG·Filed 1981·Granted Dec 28, 1982·8 cites·11 claims
- 4245US4801681AMethod for the manufacture of polyimidazole and polyimidazo-pyrrolone precursors from tetra carboxylic acid moiety reactantSIEMENS AG·Filed 1987·Granted Jan 31, 1989·7 cites·5 claims
- 4344US5760162APreparation of poly-o-hydroxyamides and poly-o-mercaptoamidesSIEMENS AG·Filed 1996·Granted Jun 2, 1998·9 cites·6 claims
- 4442US5275920AMethod of dry development utilizing quinone diazide and basic polymer resist with latent image intensification through treatment with silicon-organic compound in waterSIEMENS AG·Filed 1991·Granted Jan 4, 1994·6 cites·2 claims
- 4542US4514043AMethod for the preparation of orientation layers for liquid crystal displays and liquid crystal displays having orientation layersSIEMENS AG·Filed 1982·Granted Apr 30, 1985·7 cites·7 claims
- 4642US4398009APolyoxazole precursor and the preparation thereofSIEMENS AG·Filed 1980·Granted Aug 9, 1983·6 cites·6 claims
- 4742US4292398AMethod for the preparation of relief structures by phototechniquesSIEMENS AG·Filed 1980·Granted Sep 29, 1981·7 cites·7 claims
- 4841US4332882AMethod for the preparation of highly heat-resistant reliefSIEMENS AG·Filed 1980·Granted Jun 1, 1982·6 cites·7 claims
- 4940US5807969APreparation of poly-O-hydroxyamides and poly O-mercaptoamidesSIEMENS AG·Filed 1996·Granted Sep 15, 1998·6 cites·12 claims
- 5040US5703186AMixed polymersSIEMENS AG·Filed 1996·Granted Dec 30, 1997·5 cites·9 claims
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