Inventor · disambiguated record
Tjandra Winata Karta
Also filed as: KARTA TJANDRA · KARTA TJANDRA W · KARTA TJANDRA WINATA
17 granted patents·4 pending applications·442 citations·filing 1992–2012
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG11LEE CHIEN HSIUN3LU SZU WEI2LU SZU W1TAIWAN SEMCONDUCTOR MFG CO LTD1
Top patents by PatentIndex Score
21 records- 0197US7427803B2Electromagnetic shielding using through-silicon viasTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 23, 2008·84 cites·18 claims
- 0296US7863742B2Back end integrated WLCSP structure without aluminum padsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 4, 2011·72 cites·20 claims
- 0396US7838424B2Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etchingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 23, 2010·84 cites·20 claims
- 0493US7804177B2Silicon-based thin substrate and packaging schemesTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 28, 2010·31 cites·11 claims
- 0592US7842548B2Fixture for P-through silicon via assemblyTAIWAN SEMCONDUCTOR MFG CO LTD·Filed 2008·Granted Nov 30, 2010·29 cites·9 claims
- 0691US7514775B2Stacked structures and methods of fabricating stacked structuresTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 7, 2009·24 cites·21 claims
- 0790US7656042B2Stratified underfill in an IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 2, 2010·17 cites·22 claims
- 0882US8334170B2Method for stacking devicesWANG DEAN·Filed 2008·Granted Dec 18, 2012·10 cites·14 claims
- 0981US5331200ALead-on-chip inner lead bonding lead frame method and apparatusTEXAS INSTRUMENTS INC·Filed 1992·Granted Jul 19, 1994·81 cites·7 claims
- 1070US7846769B2Stratified underfill method for an IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Dec 7, 2010·3 cites·19 claims
- 1168US8174129B2Silicon-based thin substrate and packaging schemesLU SZU WEI·Filed 2010·Granted May 8, 2012·2 cites·20 claims
- 1262US8551813B2Wafer level IC assembly methodLEE CHIEN HSIUN·Filed 2012·Granted Oct 8, 2013·1 cites·20 claims
- 1362US8049323B2Chip holder with wafer level redistribution layerTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 1, 2011·2 cites·15 claims
- 1461US8704383B2Silicon-based thin substrate and packaging schemesLU SZU-WEI·Filed 2012·Granted Apr 22, 2014·1 cites·22 claims
- 1557US7977155B2Wafer-level flip-chip assembly methodsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 12, 2011·1 cites·5 claims
- 1652US2009174071A1Semiconductor device including electrically conductive bump and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2009·Application pending·0 cites
- 1751US8247267B2Wafer level IC assembly methodLEE CHIEN HSIUN·Filed 2008·Granted Aug 21, 2012·0 cites·10 claims
- 1849US2013127049A1Method for Stacking Devices and Structure ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Application pending·0 cites
- 1947US2007267745A1Semiconductor device including electrically conductive bump and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 2043US8232183B2Process and apparatus for wafer-level flip-chip assemblyLEE CHIEN-HSIUN·Filed 2007·Granted Jul 31, 2012·0 cites·14 claims
- 2141US2007246821A1Utra-thin substrate package technologyLU SZU W·Filed 2006·Application pending·0 cites
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