Inventor · disambiguated record
Kwang Joo Lee
Also filed as: LEE KWANG JOO
56 granted patents·9 pending applications·30 citations·filing 2003–2023
97Inventor score
Top patents by PatentIndex Score
65 records- 0186US11527503B2Method for manufacturing semiconductor packageLG CHEMICAL LTD·Filed 2020·Granted Dec 13, 2022·2 cites·10 claims
- 0284US9416243B2Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resistLG CHEMICAL LTD·Filed 2014·Granted Aug 16, 2016·3 cites·22 claims
- 0383US9953945B2Adhesive resin compostition for bonding semiconductors and adhesive film for semiconductorsLG CHEMICAL LTD·Filed 2015·Granted Apr 24, 2018·4 cites·20 claims
- 0482US10526513B2Composition for forming adhesive layer of dicing film, and dicing filmLG CHEMICAL LTD·Filed 2014·Granted Jan 7, 2020·2 cites·10 claims
- 0581US9761476B2Dicing film and dicing die-bonding filmLG CHEMICAL LTD·Filed 2014·Granted Sep 12, 2017·4 cites·15 claims
- 0681US9134609B2Photo-curable and thermo-curable resin compostion, and dry film solder resistLG CHEMICAL LTD·Filed 2014·Granted Sep 15, 2015·2 cites·25 claims
- 0774US11178730B2Method for manufacturing heating elementLG CHEMICAL LTD·Filed 2016·Granted Nov 16, 2021·2 cites·14 claims
- 0874US9049778B2Polyamic acid, photosensitive resin composition, dry film and circuit boardKYUNG YOU-JIN·Filed 2012·Granted Jun 2, 2015·2 cites·18 claims
- 0974US8349538B2Photo-curable and thermo-curable resin composition, and a dry film solder resistLG CHEMICAL LTD·Filed 2011·Granted Jan 8, 2013·2 cites·2 claims
- 1069US8288656B2Low temperature curable photosensitive resin composition and dry film manufactured by using the sameLEE KWANG-JOO·Filed 2010·Granted Oct 16, 2012·2 cites·15 claims
- 1168US12448490B2Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the sameLG CHEMICAL LTD·Filed 2023·Granted Oct 21, 2025·0 cites·4 claims
- 1268US11939494B2Resin composition for bonding semiconductor and adhesive film for semiconductor using the sameLG CHEMICAL LTD·Filed 2021·Granted Mar 26, 2024·0 cites·12 claims
- 1367US10253223B2Semiconductor device and method for manufacturing the same using an adhesiveLG CHEMICAL LTD·Filed 2017·Granted Apr 9, 2019·1 cites·20 claims
- 1467US8334092B2Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical propertyCHOI BO-YUN·Filed 2011·Granted Dec 18, 2012·2 cites·17 claims
- 1564US11479699B2Adhesive film for semiconductorLG CHEMICAL LTD·Filed 2018·Granted Oct 25, 2022·0 cites·16 claims
- 1663US12378447B2Semiconductor adhesive composition and semiconductor adhesive film comprising cured product thereofLG CHEMICAL LTD·Filed 2020·Granted Aug 5, 2025·0 cites·11 claims
- 1763US9880467B2Photo-curable and thermo-curable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2013·Granted Jan 30, 2018·1 cites·16 claims
- 1861US11515245B2Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the sameLG CHEMICAL LTD·Filed 2018·Granted Nov 29, 2022·0 cites·14 claims
- 1961US10991678B2Semiconductor device and method for manufacturing semiconductor deviceLG CHEMICAL LTD·Filed 2020·Granted Apr 27, 2021·0 cites·2 claims
- 2061US9389504B2Photo-curable and thermo-curable resin composition, and dry film solder resistLG CHEMICAL LTD·Filed 2013·Granted Jul 12, 2016·0 cites·18 claims
- 2160US2023220153A1Curing agent, adhesive composition for semiconductor comprising same, adhesive film for semiconductor, and semiconductor package using sameLG CHEMICAL LTD·Filed 2021·Application pending·0 cites
- 2257US11993731B2Adhesive composition for semiconductor circuit connection and adhesive film containing the sameLG CHEMICAL LTD·Filed 2020·Granted May 28, 2024·0 cites·8 claims
- 2356US11760907B2Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the sameLG CHEMICAL LTD·Filed 2021·Granted Sep 19, 2023·0 cites·9 claims
- 2455US12286564B2Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the sameLG CHEMICAL LTD·Filed 2020·Granted Apr 29, 2025·0 cites·12 claims
- 2555US11932784B2Adhesive composition for dicing tape and dicing tape comprising the sameLG CHEMICAL LTD·Filed 2020·Granted Mar 19, 2024·0 cites·12 claims
- 2655US11466184B2Adhesive compositionLG CHEMICAL LTD·Filed 2019·Granted Oct 11, 2022·0 cites·15 claims
- 2754US10759971B2Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding filmLG CHEMICAL LTD·Filed 2016·Granted Sep 1, 2020·0 cites·13 claims
- 2853US12024654B2Non-conductive film and manufacturing method of semiconductor laminateLG CHEMICAL LTD·Filed 2020·Granted Jul 2, 2024·0 cites·13 claims
- 2953US10865329B2Adhesive film for semiconductorLG CHEMICAL LTD·Filed 2016·Granted Dec 15, 2020·0 cites·16 claims
- 3051US12460113B2Adhesive composition for dicing tape and dicing tape including the sameLG CHEMICAL LTD·Filed 2020·Granted Nov 4, 2025·0 cites·20 claims
- 3151US12341033B2Apparatus for separating semiconductor chip and method for separating semiconductor by using sameLG CHEMICAL LTD·Filed 2021·Granted Jun 24, 2025·0 cites·13 claims
- 3251US12006308B2Adhesive composition for semiconductor circuit connection and adhesive film containing the sameLG CHEMICAL LTD·Filed 2019·Granted Jun 11, 2024·0 cites·9 claims
- 3351US11702520B2Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the sameLG CHEMICAL LTD·Filed 2019·Granted Jul 18, 2023·0 cites·6 claims
- 3451US2010316877A1Method for preparing polyimide and polyimide prepared using the sameLG CHEMICAL LTD·Filed 2008·Application pending·0 cites
- 3551US2024254372A1Adhesive composition for semiconductor processing, film comprising same for semiconductor processing, and method for producing semiconductor package using sameLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 3650US10707187B2Semiconductor device and method for manufacturing semiconductor deviceLG CHEMICAL LTD·Filed 2016·Granted Jul 7, 2020·0 cites·5 claims
- 3749US11834415B2Adhesive composition for semiconductor circuit connection and adhesive film including the sameLG CHEMICAL LTD·Filed 2019·Granted Dec 5, 2023·0 cites·14 claims
- 3849US9410017B2Poly-amic acid, photo-sensitive resin composition, dry film, and circuit boardLG CHEMICAL LTD·Filed 2013·Granted Aug 9, 2016·0 cites·17 claims
- 3948US9778566B2Photocurable and thermocurable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2015·Granted Oct 3, 2017·0 cites·23 claims
- 4047US11702571B2Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the sameLG CHEMICAL LTD·Filed 2019·Granted Jul 18, 2023·0 cites·12 claims
- 4147US11404301B2Dicing die-bonding filmLG CHEMICAL LTD·Filed 2018·Granted Aug 2, 2022·0 cites·8 claims
- 4247US10510579B2Adhesive resin composition for semiconductor, adhesive film for semiconductor, and dicing die bonding filmLG CHEMICAL LTD·Filed 2017·Granted Dec 17, 2019·0 cites·16 claims
- 4347US9540547B2Composition for forming adhesive layer of dicing film, and dicing filmLG CHEMICAL LTD·Filed 2014·Granted Jan 10, 2017·0 cites·15 claims
- 4447US2011200939A1Polyamic acid, polyimide, photosensitive resin composition comprising the same and dry film manufactured by the sameLG CHEMICAL LTD·Filed 2010·Application pending·0 cites
- 4546US10796818B2Heating elementLG CHEMICAL LTD·Filed 2016·Granted Oct 6, 2020·0 cites·6 claims
- 4646US9788434B2Preparation method for dry film solder resist and film laminate used thereinLG CHEMICAL LTD·Filed 2014·Granted Oct 10, 2017·0 cites·16 claims
- 4746US2022154043A1Adhesive composition for dicing film, dicing film and dicing die bond filmLG CHEMICAL LTD·Filed 2021·Application pending·0 cites
- 4845US11466178B2Back-grinding tapeLG CHEMICAL LTD·Filed 2019·Granted Oct 11, 2022·0 cites·11 claims
- 4945US11424153B2Back grinding tapeLG CHEMICAL LTD·Filed 2019·Granted Aug 23, 2022·0 cites·12 claims
- 5045US8354219B2Photosensitive resin composition and dry film comprising the sameLG CHEMICAL LTD·Filed 2011·Granted Jan 15, 2013·0 cites·23 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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