Inventor · disambiguated record
Biancun Xie
Also filed as: Xie Biancun
4 granted patents·1 pending application·1 citations·filing 2019–2022
56Inventor score
Top patents by PatentIndex Score
5 records- 0180US11626359B2Three-dimensional integrated circuit (3D IC) power distribution network (PDN) capacitor integrationQUALCOMM INC·Filed 2021·Granted Apr 11, 2023·1 cites·20 claims
- 0258US12160952B2Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methodsQUALCOMM INC·Filed 2022·Granted Dec 3, 2024·0 cites·28 claims
- 0357US11749661B2Package comprising a substrate and a multi-capacitor integrated passive deviceQUALCOMM INC·Filed 2021·Granted Sep 5, 2023·0 cites·27 claims
- 0448US2023402380A1Package comprising a substrate with a bridge configured for a back side power distribution networkQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0544US12341129B2Substrateless double-sided embedded multi-die interconnect bridgeINTEL CORP·Filed 2019·Granted Jun 24, 2025·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →