Inventor · disambiguated record
Byung-Jae Kang
Also filed as: KANG BYUNG-JAE
3 granted patents·2 citations·filing 2019–2022
52Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0173US10930544B2Method of manufacturing semiconductor device having buried gate electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·2 cites·20 claims
- 0258US11670537B2Method of manufacturing semiconductor device having buried gate electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·21 claims
- 0354US12446267B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →