Inventor · disambiguated record
David Fraser Rae
Also filed as: RAE DAVID FRASER
13 granted patents·4 pending applications·75 citations·filing 2013–2024
89Inventor score
Files withQUALCOMM INC17
Top patents by PatentIndex Score
17 records- 0196US10410971B2Thermal and electromagnetic interference shielding for die embedded in package substrateQUALCOMM INC·Filed 2017·Granted Sep 10, 2019·37 cites·30 claims
- 0291US9601472B2Package on package (POP) device comprising solder connections between integrated circuit device packagesQUALCOMM INC·Filed 2015·Granted Mar 21, 2017·9 cites·20 claims
- 0389US9679873B2Low profile integrated circuit (IC) package comprising a plurality of diesQUALCOMM INC·Filed 2015·Granted Jun 13, 2017·6 cites·30 claims
- 0487US9484327B2Package-on-package structure with reduced heightQUALCOMM INC·Filed 2013·Granted Nov 1, 2016·10 cites·10 claims
- 0582US9985010B2System, apparatus, and method for embedding a device in a faceup workpieceQUALCOMM INC·Filed 2015·Granted May 29, 2018·4 cites·18 claims
- 0678US11670599B2Package comprising passive device configured as electromagnetic interference shieldQUALCOMM INC·Filed 2020·Granted Jun 6, 2023·1 cites·24 claims
- 0778US10163687B2System, apparatus, and method for embedding a 3D component with an interconnect structureQUALCOMM INC·Filed 2015·Granted Dec 25, 2018·3 cites·10 claims
- 0874US11404343B2Package comprising a substrate configured as a heat spreaderQUALCOMM INC·Filed 2020·Granted Aug 2, 2022·1 cites·30 claims
- 0971US9601435B2Semiconductor package with embedded components and method of making the sameQUALCOMM INC·Filed 2015·Granted Mar 21, 2017·2 cites·14 claims
- 1067US9355898B2Package on package (PoP) integrated device comprising a plurality of solder resist layersQUALCOMM INC·Filed 2014·Granted May 31, 2016·2 cites·22 claims
- 1159US2025273597A1Embedded scaffold stiffener in substrateQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1252US11502049B2Package comprising multi-level vertically stacked redistribution portionsQUALCOMM INC·Filed 2020·Granted Nov 15, 2022·0 cites·22 claims
- 1348US11393808B2Ultra-low profile stacked RDL semiconductor packageQUALCOMM INC·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
- 1446US2021280523A1Integrated circuit (ic) packages employing split, double-sided metallization structures to facilitate a semiconductor die ("die") module employing stacked dice, and related fabrication methodsQUALCOMM INC·Filed 2020·Application pending·0 cites
- 1540US9806048B2Planar fan-out wafer level packagingQUALCOMM INC·Filed 2016·Granted Oct 31, 2017·0 cites·23 claims
- 1639US2019341352A1Tapered corner package for emi shieldQUALCOMM INC·Filed 2018·Application pending·0 cites
- 1733US2016148864A1Integrated device package comprising heterogeneous solder joint structureQUALCOMM INC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →