Inventor · disambiguated record
Zhao-Chong Zeng
Also filed as: ZENG ZHAO · ZENG ZHAO C · ZENG ZHAO-CHONG
12 granted patents·10 pending applications·94 citations·filing 2006–2024
88Inventor score
Files withZENG ZHAO-CHONG5CAIHONG DISPLAY DEVICES CO LTD4PHOENIX PREC TECHNOLOGY CORP4UNIMICRON TECHNOLOGY CORP4HSU SHIH-PING2
Top patents by PatentIndex Score
22 records- 0196US7763969B2Structure with semiconductor chips embeded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jul 27, 2010·62 cites·7 claims
- 0285US8829356B2Packaging substrate having a passive element embedded therein and method of fabricating the sameHSU SHIH-PING·Filed 2011·Granted Sep 9, 2014·7 cites·7 claims
- 0383US7948085B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted May 24, 2011·12 cites·6 claims
- 0473US9179549B2Packaging substrate having embedded passive component and fabrication method thereofHSU SHIH-PING·Filed 2010·Granted Nov 3, 2015·3 cites·7 claims
- 0568US9129870B2Package structure having embedded electronic componentUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Sep 8, 2015·2 cites·2 claims
- 0664US7554131B2Chip embedded package structure and fabrication method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jun 30, 2009·3 cites·8 claims
- 0763US9232665B2Method of fabricating packaging substrate having a passive element embedded thereinUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Jan 5, 2016·1 cites·4 claims
- 0860US8242383B2Packaging substrate with embedded semiconductor component and method for fabricating the sameZENG ZHAO CHONG·Filed 2009·Granted Aug 14, 2012·2 cites·5 claims
- 0959US2024124347A1Flexible glass and preparation method thereforCAIHONG DISPLAY DEVICES CO LTD·Filed 2023·Application pending·0 cites
- 1057US2025197274A1Low thermal shrinkage glasses and methods for preparing thereofCAIHONG DISPLAY DEVICES CO LTD·Filed 2024·Application pending·0 cites
- 1157US2024124348A1Electronic glass having high liquidus viscosity and preparation methodCAIHONG DISPLAY DEVICES CO LTD·Filed 2023·Application pending·0 cites
- 1256US2025091940A1High-hardness electronic glass and preparation methods thereofCAIHONG DISPLAY DEVICES CO LTD·Filed 2024·Application pending·0 cites
- 1353US8421213B2Package structureHSU SHIN-PING·Filed 2009·Granted Apr 16, 2013·2 cites·19 claims
- 1446US9295159B2Method for fabricating packaging substrate with embedded semiconductor componentZENG ZHAO CHONG·Filed 2012·Granted Mar 22, 2016·0 cites·14 claims
- 1545US10219390B2Fabrication method of packaging substrate having embedded passive componentUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Feb 26, 2019·0 cites·4 claims
- 1645US8884429B2Package structure having embedded electronic component and fabrication method thereofZENG ZHAO-CHONG·Filed 2012·Granted Nov 11, 2014·0 cites·10 claims
- 1743US2007241444A1Carrier board structure with chip embedded therein and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1841US2007087547A1Wafer structure with electroless plating metal connecting layer and method for fabricating the sameCHEN SHANG W·Filed 2006·Application pending·0 cites
- 1941US2008048310A1Carrier Board Structure Embedded with Semiconductor Component and Method for Fabricating the Carrier Board StructurePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 2037US2007085205A1Semiconductor device with electroless plating metal connecting layer and method for fabricating the sameCHEN SHANG-WEI·Filed 2006·Application pending·0 cites
- 2137US2013258623A1Package structure having embedded electronic element and fabrication method thereofZENG ZHAO-CHONG·Filed 2012·Application pending·0 cites
- 2235US2012049366A1Package structure having through-silicon-via (tsv) chip embedded therein and fabrication method thereofZENG ZHAO-CHONG·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →