Inventor · disambiguated record
Chun I Tseng
Also filed as: TSENG CHUN-I
2 granted patents·6 citations·filing 2018–2019
44Inventor score
Files withINVENTEC PUDONG TECH CORP2
Top patents by PatentIndex Score
2 records- 0183US10219366B1Multilayer printed circuit board capable of reducing transmission loss of high speed signalsINVENTEC PUDONG TECH CORP·Filed 2018·Granted Feb 26, 2019·6 cites·4 claims
- 0248US11474136B2Method for examining differential pair transmission linesINVENTEC PUDONG TECH CORP·Filed 2019·Granted Oct 18, 2022·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →