Inventor · disambiguated record
Michael Brownell
Also filed as: BROWNELL MICHAEL · BROWNELL MICHAEL P · BROWNELL MICHAEL PHILIP
22 granted patents·784 citations·filing 1996–2000
97Inventor score
Top patents by PatentIndex Score
22 records- 0191US6410982B1Heatpipesink having integrated heat pipe and heat sinkINTEL CORP·Filed 1999·Granted Jun 25, 2002·124 cites·5 claims
- 0289US6166908AIntegrated circuit cartridgeINTEL CORP·Filed 1999·Granted Dec 26, 2000·84 cites·26 claims
- 0387US5990552AApparatus for attaching a heat sink to the back side of a flip chip packageINTEL CORP·Filed 1997·Granted Nov 23, 1999·105 cites·26 claims
- 0486US5991161AMulti-chip land grid array carrierINTEL CORP·Filed 1997·Granted Nov 23, 1999·74 cites·17 claims
- 0578US5699229ACompliant hinge clip attachmentINTEL CORP·Filed 1996·Granted Dec 16, 1997·53 cites·15 claims
- 0677US6016006AThermal grease insertion and retentionINTEL CORP·Filed 1997·Granted Jan 18, 2000·56 cites·3 claims
- 0775US5699227AHeat pipe to baseplate attachment methodINTEL CORP·Filed 1996·Granted Dec 16, 1997·42 cites·15 claims
- 0872US5949647AHeat pipe to baseplate attachment methodINTEL CORP·Filed 1997·Granted Sep 7, 1999·37 cites·4 claims
- 0969US6097611AMulti-chip land grid array carrierINTEL CORP·Filed 1999·Granted Aug 1, 2000·30 cites·17 claims
- 1065US6614829B1Mechanically grounded tunable laserNEW FOCUS INC·Filed 1999·Granted Sep 2, 2003·19 cites·19 claims
- 1164US6164999AZero insertion force socket and method for employing same to mount a processorINTEL CORP·Filed 1997·Granted Dec 26, 2000·22 cites·29 claims
- 1259US5903436AEmulative lid/heatspreader for processor die attached to an organic substrateINTEL CORP·Filed 1997·Granted May 11, 1999·28 cites·20 claims
- 1359US5847885AWide range cylindrical mirror mount with radial clampNEW FOCUS INC·Filed 1997·Granted Dec 8, 1998·20 cites·24 claims
- 1458US5802707AControlled bondline thickness attachment mechanismINTEL CORP·Filed 1996·Granted Sep 8, 1998·21 cites·7 claims
- 1557US5953164AWide range cylindrical mirror mount with radial clampNEW FOCUS INC·Filed 1998·Granted Sep 14, 1999·18 cites·8 claims
- 1652US6443749B2Fixed position ZIF (zero insertion force) socket systemINTEL CORP·Filed 2000·Granted Sep 3, 2002·8 cites·36 claims
- 1748US6506073B2Mounting bracket for integrated circuit deviceINTEL CORP·Filed 1999·Granted Jan 14, 2003·13 cites·16 claims
- 1840US6349465B1Controlled bondline thickness attachment mechanismINTEL CORP·Filed 1998·Granted Feb 26, 2002·8 cites·13 claims
- 1940US6002591APrinted circuit board mounting assembly and a method for mounting an integrated circuit deviceINTEL CORP·Filed 1997·Granted Dec 14, 1999·8 cites·19 claims
- 2039US5956229AInjection molded thermal interface systemINTEL CORP·Filed 1998·Granted Sep 21, 1999·8 cites·11 claims
- 2132US6490167B1Semiconductor package ejectorINTEL CORP·Filed 1999·Granted Dec 3, 2002·4 cites·24 claims
- 2231US6782611B2Method of assembling a multi-chip deviceINTEL CORP·Filed 1999·Granted Aug 31, 2004·2 cites·6 claims
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