Inventor · disambiguated record
Kunpei Yamada
Also filed as: YAMADA KUNPEI
2 granted patents·2 pending applications·4 citations·filing 2012–2016
44Inventor score
Top patents by PatentIndex Score
4 records- 0173US9661763B2Structure containing conductor circuit, method for manufacturing same, and heat-curable resin compositionHITACHI CHEMICAL CO LTD·Filed 2012·Granted May 23, 2017·4 cites·24 claims
- 0244US10034384B2Structure containing conductor circuit, method for manufacturing same, and heat-curable resin compositionHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·24 claims
- 0341US2014151091A1Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for sameFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
- 0437US2012305291A1Primer layer for plating process, laminate for wiring board and method for manufacture thereof, multilayer wiring board and method for manufacture thereofFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →