Inventor · disambiguated record

Haruhiko Ando

Also filed as: ANDO HARUHIKO

1 granted patent·1 pending application·10 citations·filing 2005–2005

32Inventor score

Technology areasH10W

Files withJAPAN SCIENCE & TECH AGENCY1 TAMURA SEISAKUSHO KK1

Top patents by PatentIndex Score

2 records

0174US8042727B2Heater, reflow apparatus, and solder bump forming method and apparatusTAMURA SEISAKUSHO KK·Filed 2005·Granted Oct 25, 2011·10 cites·6 claims
0234US2007181218A1Solder composition and method of bump formation therewithJAPAN SCIENCE & TECH AGENCY·Filed 2005·Application pending·0 cites

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