Inventor · disambiguated record
Junichi Onozaki
Also filed as: ONOZAKI JUNICHI
7 granted patents·1 pending application·68 citations·filing 1997–2006
84Inventor score
Top patents by PatentIndex Score
8 records- 0174US8042727B2Heater, reflow apparatus, and solder bump forming method and apparatusTAMURA SEISAKUSHO KK·Filed 2005·Granted Oct 25, 2011·10 cites·6 claims
- 0273US6364195B1Brazing ApparatusTAMURA SEISAKUSHO KK·Filed 2000·Granted Apr 2, 2002·18 cites·13 claims
- 0369US6992407B2Precision machining stage equipmentJAPAN SCIENCE & TECH AGENCY·Filed 2003·Granted Jan 31, 2006·12 cites·39 claims
- 0449US7350686B2Method for supplying solderTAMURA SEISAKUSHO KK·Filed 2002·Granted Apr 1, 2008·4 cites·8 claims
- 0547US6050473ABrazing apparatusTAMURA SEISA KUSHO KK·Filed 1997·Granted Apr 18, 2000·14 cites·15 claims
- 0643US5981922ABrazing apparatus having electromagnetic induction pumps for moving a brazing filler metal in contact with a workpieceTAMURA SEISAKUSHO KK·Filed 1997·Granted Nov 9, 1999·10 cites·9 claims
- 0734US2007181218A1Solder composition and method of bump formation therewithJAPAN SCIENCE & TECH AGENCY·Filed 2005·Application pending·0 cites
- 0833US8104661B2Heating device, reflow device, heating method, and bump forming methodONOZAKI JUNICHI·Filed 2006·Granted Jan 31, 2012·0 cites·12 claims
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