Inventor · disambiguated record
Carmen D. Burns
Also filed as: BURNS CARMEN · BURNS CARMEN D
74 granted patents·1 pending application·5,978 citations·filing 1975–2005
99Inventor score
Top patents by PatentIndex Score
75 records- 0199US5484959AHigh density lead-on-package fabrication method and apparatusSTAKTEK CORP·Filed 1992·Granted Jan 16, 1996·232 cites·43 claims
- 0299US5279029AUltra high density integrated circuit packages methodSTAKTEK CORP·Filed 1993·Granted Jan 18, 1994·467 cites·24 claims
- 0398US6205654B1Method of manufacturing a surface mount packageSTAKTEK GROUP LP·Filed 1998·Granted Mar 27, 2001·176 cites·27 claims
- 0498US5221642ALead-on-chip integrated circuit fabrication methodSTAKTEK CORP·Filed 1991·Granted Jun 22, 1993·345 cites·43 claims
- 0598US4188438AAntioxidant coating of copper parts for thermal compression gang bonding of semiconductive devicesNAT SEMICONDUCTOR CORP·Filed 1975·Granted Feb 12, 1980·108 cites·17 claims
- 0697US6919626B2High density integrated circuit moduleSTAKTEK GROUP LP·Filed 2001·Granted Jul 19, 2005·96 cites·13 claims
- 0797US6572387B2Flexible circuit connector for stacked chip moduleSTAKTEK GROUP LP·Filed 2002·Granted Jun 3, 2003·100 cites·20 claims
- 0897US5631193AHigh density lead-on-package fabrication methodSTAKTEK CORP·Filed 1995·Granted May 20, 1997·119 cites·8 claims
- 0997US4355463AProcess for hermetically encapsulating semiconductor devicesNAT SEMICONDUCTOR CORP·Filed 1980·Granted Oct 26, 1982·141 cites·10 claims
- 1096US7066741B2Flexible circuit connector for stacked chip moduleSTAKTEK GROUP LP·Filed 2003·Granted Jun 27, 2006·78 cites·6 claims
- 1196US5550711AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1995·Granted Aug 27, 1996·164 cites·7 claims
- 1296US5420751AUltra high density modular integrated circuit packageSTAKTEK CORP·Filed 1993·Granted May 30, 1995·160 cites·32 claims
- 1395US5552963ABus communication system for stacked high density integrated circuit packagesSTAKTEK CORP·Filed 1995·Granted Sep 3, 1996·142 cites·1 claims
- 1495US5455740ABus communication system for stacked high density integrated circuit packagesSTAKTEK CORP·Filed 1994·Granted Oct 3, 1995·119 cites·22 claims
- 1594US4209355AManufacture of bumped composite tape for automatic gang bonding of semiconductor devicesNAT SEMICONDUCTOR CORP·Filed 1978·Granted Jun 24, 1980·90 cites·9 claims
- 1693US5644161AUltra-high density warp-resistant memory moduleSTAKTEK CORP·Filed 1995·Granted Jul 1, 1997·115 cites·17 claims
- 1793US5585668AIntegrated circuit package with overlapped die on a common lead frameSTAKTEK CORP·Filed 1996·Granted Dec 17, 1996·76 cites·19 claims
- 1893US5572065AHermetically sealed ceramic integrated circuit heat dissipating packageSTAKTEK CORP·Filed 1994·Granted Nov 5, 1996·128 cites·63 claims
- 1993US5566051AUltra high density integrated circuit packages method and apparatusSTAKTEK CORP·Filed 1994·Granted Oct 15, 1996·98 cites·17 claims
- 2093US5543664AUltra high density integrated circuit packageSTAKTEK CORP·Filed 1995·Granted Aug 6, 1996·105 cites·11 claims
- 2193US5479318ABus communication system for stacked high density integrated circuit packages with trifurcated distal lead endsSTAKTEK CORP·Filed 1995·Granted Dec 26, 1995·96 cites·8 claims
- 2292US5801437AThree-dimensional warp-resistant integrated circuit module method and apparatusSTAKTEK CORP·Filed 1995·Granted Sep 1, 1998·113 cites·2 claims
- 2392US5493476ABus communication system for stacked high density integrated circuit packages with bifurcated distal lead endsSTAKTEK CORP·Filed 1995·Granted Feb 20, 1996·95 cites·15 claims
- 2491US5654877ALead-on-chip integrated circuit apparatusSTAKTEK CORP·Filed 1995·Granted Aug 5, 1997·99 cites·11 claims
- 2591US5446620AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1993·Granted Aug 29, 1995·95 cites·28 claims
- 2691US4607779ANon-impact thermocompression gang bonding methodNAT SEMICONDUCTOR CORP·Filed 1983·Granted Aug 26, 1986·78 cites·3 claims
- 2790US6608763B1Stacking system and methodSTAKTEK GROUP LP·Filed 2000·Granted Aug 19, 2003·58 cites·24 claims
- 2890US6049123AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1997·Granted Apr 11, 2000·80 cites·20 claims
- 2990US6025642AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1997·Granted Feb 15, 2000·112 cites·6 claims
- 3090US5843807AMethod of manufacturing an ultra-high density warp-resistant memory moduleSTAKTEK CORP·Filed 1996·Granted Dec 1, 1998·88 cites·14 claims
- 3190US5499160AHigh density integrated circuit module with snap-on rail assembliesSTAKTEK CORP·Filed 1995·Granted Mar 12, 1996·115 cites·17 claims
- 3290US5377077AUltra high density integrated circuit packages method and apparatusSTAKTEK CORP·Filed 1993·Granted Dec 27, 1994·114 cites·22 claims
- 3389US5783464AMethod of forming a hermetically sealed circuit lead-on packageSTAKTEK CORP·Filed 1997·Granted Jul 21, 1998·92 cites·14 claims
- 3488US6168970B1Ultra high density integrated circuit packagesSTAKTEK GROUP LP·Filed 1999·Granted Jan 2, 2001·64 cites·18 claims
- 3588US4000842ACopper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devicesNAT SEMICONDUCTOR CORP·Filed 1975·Granted Jan 4, 1977·57 cites·14 claims
- 3687US5804870AHermetically sealed integrated circuit lead-on package configurationSTAKTEK CORP·Filed 1995·Granted Sep 8, 1998·85 cites·11 claims
- 3787US5528075ALead-on-chip integrated circuit apparatusSTAKTEK CORP·Filed 1995·Granted Jun 18, 1996·73 cites·10 claims
- 3887US4331740AGang bonding interconnect tape process and structure for semiconductor device automatic assemblyNAT SEMICONDUCTOR CORP·Filed 1980·Granted May 25, 1982·59 cites·9 claims
- 3987US4330790ATape operated semiconductor device packagingNAT SEMICONDUCTOR CORP·Filed 1980·Granted May 18, 1982·61 cites·10 claims
- 4087US4063993AMethod of making gang bonding interconnect tape for semiconductive devicesNAT SEMICONDUCTOR CORP·Filed 1975·Granted Dec 20, 1977·55 cites·11 claims
- 4186US6288907B1High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain reliefSTAKTEK GROUP LP·Filed 1999·Granted Sep 11, 2001·66 cites·3 claims
- 4286US5828125AUltra-high density warp-resistant memory moduleSTAKTEK CORP·Filed 1996·Granted Oct 27, 1998·68 cites·4 claims
- 4386US5561591AMulti-signal rail assembly with impedance control for a three-dimensional high density integrated circuit packageSTAKTEK CORP·Filed 1994·Granted Oct 1, 1996·58 cites·22 claims
- 4486US5367766AUltra high density integrated circuit packages methodSTAKTEK CORP·Filed 1993·Granted Nov 29, 1994·87 cites·15 claims
- 4583US5778522AMethod of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain reliefSTAKTEK CORP·Filed 1996·Granted Jul 14, 1998·56 cites·1 claims
- 4683US5615475AMethod of manufacturing an integrated package having a pair of die on a common lead frameSTAKTEK CORP·Filed 1995·Granted Apr 1, 1997·40 cites·23 claims
- 4780US6310392B1Stacked micro ball grid array packagesSTAKTEK GROUP LP·Filed 1998·Granted Oct 30, 2001·58 cites·17 claims
- 4880US5541812ABus communication system for stacked high density integrated circuit packages having an intermediate lead frameFiled 1995·Granted Jul 30, 1996·60 cites·2 claims
- 4980US5369056AWarp-resistent ultra-thin integrated circuit package fabrication methodSTAKTEK CORP·Filed 1993·Granted Nov 29, 1994·43 cites·18 claims
- 5080US4466183AIntegrated circuit packaging processNAT SEMICONDUCTOR CORP·Filed 1982·Granted Aug 21, 1984·47 cites·10 claims
Showing the top 50 of 75 patent records by PatentIndex Score.
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