Inventor · disambiguated record
Miki Morita
Also filed as: MORITA MIKI
5 granted patents·5 pending applications·49 citations·filing 1989–2013
77Inventor score
Top patents by PatentIndex Score
10 records- 0189US5112532ANon-linear optical material and non-linear optical device employing itKONISHIROKU PHOTO IND·Filed 1989·Granted May 12, 1992·28 cites·4 claims
- 0287US9123794B2Dicing die bond filmNITTO DENKO CORP·Filed 2013·Granted Sep 1, 2015·10 cites·7 claims
- 0360US8841757B2Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor deviceUENDA DAISUKE·Filed 2011·Granted Sep 23, 2014·1 cites·7 claims
- 0444US4909598ANon-linear optical deviceKONISHIROKU PHOTO IND·Filed 1989·Granted Mar 20, 1990·10 cites·8 claims
- 0543US2012061805A1Dicing die bond filmAMANO YASUHIRO·Filed 2011·Application pending·0 cites
- 0637US8658515B2Method of manufacturing film for semiconductor deviceINOUE KOICHI·Filed 2012·Granted Feb 25, 2014·0 cites·7 claims
- 0736US2012126379A1Die bond film, dicing die bond film, method of manufacturing die bond film, and semiconductor device having die bond filmUENDA DAISUKE·Filed 2011·Application pending·0 cites
- 0836US2012126381A1Adhesive film for semiconductor device, and semiconductor deviceUENDA DAISUKE·Filed 2011·Application pending·0 cites
- 0935US2012058625A1Film for semiconductor device, and semiconductor deviceAMANO YASUHIRO·Filed 2011·Application pending·0 cites
- 1031US2012231583A1Die-bonding film and use thereofONISHI KENJI·Filed 2012·Application pending·0 cites
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