Inventor · disambiguated record
Seung Lo Lee
Also filed as: LEE SEUNG-LO
2 granted patents·5 citations·filing 2018–2019
43Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0183US10784244B2Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 22, 2020·5 cites·13 claims
- 0238US10886253B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →