Inventor · disambiguated record
Kazuto Nishida
Also filed as: NISHIDA KAZUTO
19 granted patents·5 pending applications·526 citations·filing 1992–2009
96Inventor score
Top patents by PatentIndex Score
24 records- 0198US7683482B2Electronic component unitPANASONIC CORP·Filed 2006·Granted Mar 23, 2010·57 cites·8 claims
- 0294US6926796B1Electronic parts mounting method and device thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 9, 2005·57 cites·2 claims
- 0392US8007627B2Electronic component mounting method and apparatusPANASONIC CORP·Filed 2005·Granted Aug 30, 2011·18 cites·1 claims
- 0490US6981317B1Method and device for mounting electronic component on circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 3, 2006·75 cites·28 claims
- 0585US6086441AMethod for connecting electrodes of plasma display panelMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jul 11, 2000·62 cites·17 claims
- 0685US5917156ACircuit board having electrodes and pre-deposit solder receiverMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 29, 1999·62 cites·3 claims
- 0783US7090502B2Board connecting component and three-dimensional connecting structure using thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Aug 15, 2006·12 cites·15 claims
- 0876US7613010B2Stereoscopic electronic circuit device, and relay board and relay frame used thereinPANASONIC CORP·Filed 2004·Granted Nov 3, 2009·17 cites·25 claims
- 0973US6156150AIC component separating method and separating apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 5, 2000·44 cites·23 claims
- 1073US5858806AMethod of bonding IC component to flat panel displayMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jan 12, 1999·45 cites·17 claims
- 1171US7771561B2Apparatus and method for surface treatment to substratePANASONIC CORP·Filed 2006·Granted Aug 10, 2010·2 cites·10 claims
- 1269US7759784B23D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modulesPANASONIC CORP·Filed 2005·Granted Jul 20, 2010·4 cites·11 claims
- 1369US7355126B2Electronic parts packaging method and electronic parts packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 8, 2008·17 cites·19 claims
- 1463US7060528B2Method for mounting a semiconductor element to an interposer by compression bondingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 13, 2006·11 cites·16 claims
- 1557US2010008056A1Stereoscopic electronic circuit device, and relay board and relay frame used thereinPANASONIC CORP·Filed 2009·Application pending·0 cites
- 1651US7473476B2Soldering method, component to be joined by the soldering method, and joining structurePANASONIC CORP·Filed 2004·Granted Jan 6, 2009·4 cites·20 claims
- 1751US6966964B2Method and apparatus for manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 22, 2005·6 cites·5 claims
- 1851US5240170AMethod for bonding lead of IC component with electrodeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Aug 31, 1993·20 cites·6 claims
- 1950US2005224974A1Electronic component mounting method and apparatusNISHIDA KAZUTO·Filed 2005·Application pending·0 cites
- 2048US5462626AMethod of bonding an external lead and a tool thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Oct 31, 1995·13 cites·14 claims
- 2142US7960828B2Carrier frame for electronic components and production method for electronic componentsPANASONIC CORP·Filed 2008·Granted Jun 14, 2011·0 cites·9 claims
- 2241US2003049937A1Apparatus and method for surface treatment to substrateSUZUKI NAOKI·Filed 2002·Application pending·0 cites
- 2340US2007164079A1Electronic component mounting method, and circuit substrate and circuit substrate unit used in the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2439US2005093172A1Electronic circuit device, and method and apparatus for manufacturing the sameFiled 2004·Application pending·0 cites
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