Inventor · disambiguated record
Doowon Kwon
Also filed as: KWON DOOWON
14 granted patents·9 pending applications·41 citations·filing 2007–2024
88Inventor score
Top patents by PatentIndex Score
23 records- 0192US9780136B2Composite wafer semiconductor devices using offset via arrangements and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 3, 2017·12 cites·18 claims
- 0286US8415189B2Methods of fabricating image sensors including impurity layer isolation regionsKWON DOOWON·Filed 2009·Granted Apr 9, 2013·13 cites·21 claims
- 0383US7586170B2Image sensors including impurity layer adjacent isolation regionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 8, 2009·6 cites·16 claims
- 0482US10199355B2Semiconductor devices including stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 5, 2019·3 cites·20 claims
- 0581US12364047B2Image sensor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 15, 2025·1 cites·20 claims
- 0677US11393864B2Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 19, 2022·1 cites·18 claims
- 0772US10483243B2Semiconductor devices including stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 19, 2019·1 cites·18 claims
- 0871US9711554B2Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 18, 2017·2 cites·10 claims
- 0969US10930685B2Image sensor including a shield structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·1 cites·18 claims
- 1064US9859321B2Stack-type semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 2, 2018·1 cites·20 claims
- 1162US2025248161A1Image sensor and semiconductor device including through viaSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1260US2025142233A1Stacked image sensor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1360US2025031476A1Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1456US11183526B2Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 1556US2025031467A1Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1655US2024153883A1Device including overlay target structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1754US2024363665A1Semiconductor device including bonded substrates and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1854US2024178259A1Three-layered stacked image sensor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1953US11652130B2Image sensor and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 16, 2023·0 cites·20 claims
- 2053US2024014243A1Highly integrated image sensors using inter-substrate wiring structuresSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2152US2024072091A1Image sensor including landing structure having same material as gate electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2251US12507497B2Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 2342US11776982B2Image sensor chipSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
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