Inventor · disambiguated record
Christopher Youtsey
Also filed as: YOUTSEY CHRISTOPHER · YOUTSEY CHRISTOPHER T
18 granted patents·10 pending applications·326 citations·filing 2000–2025
94Inventor score
Files withMICROLINK DEVICES INC19LNL TECHNOLOGIES INC3PAN NOREN3TRI QUINT SEMICONDUCTOR INC1YOUTSEY CHRISTOPHER1
Top patents by PatentIndex Score
28 records- 0196US6636668B1Localized thermal tuning of ring resonatorsLNL TECHNOLOGIES INC·Filed 2000·Granted Oct 21, 2003·148 cites·17 claims
- 0293US6571039B1Optical waveguide having a weakly-confining waveguide section and a strongly-confining waveguide section optically coupled by a tapered neckLNL TECHNOLOGIES INC·Filed 2000·Granted May 27, 2003·82 cites·12 claims
- 0390US7994419B2Methods for fabricating thin film III-V compound solar cellMICROLINK DEVICES INC·Filed 2008·Granted Aug 9, 2011·16 cites·8 claims
- 0485US9315267B2Integration of high-efficiency, lightweight solar sheets onto unmanned aerial vehicle for increased enduranceMICROLINK DEVICES INC·Filed 2013·Granted Apr 19, 2016·10 cites·49 claims
- 0584US8440492B2Assembly techniques for solar cell arrays and solar cells formed therefromMICROLINK DEVICES INC·Filed 2012·Granted May 14, 2013·3 cites·4 claims
- 0679US10923617B2Methods for fabricating thin film III-V compound solar cellPAN NOREN·Filed 2011·Granted Feb 16, 2021·2 cites·25 claims
- 0778US9650148B2Integration of high-efficiency, lightweight solar sheets onto unmanned aerial vehicle for increased enduranceMICROLINK DEVICES INC·Filed 2016·Granted May 16, 2017·3 cites·41 claims
- 0878US8993873B2Solar cell with a backside via to contact the emitter layerYOUTSEY CHRISTOPHER·Filed 2009·Granted Mar 31, 2015·13 cites·10 claims
- 0978US6579802B1Method of forming smooth morphologies in InP-based semiconductorsLNL TECHNOLOGIES INC·Filed 2000·Granted Jun 17, 2003·34 cites·6 claims
- 1074US9356162B2High efficiency group III-V compound semiconductor solar cell with oxidized window layerPAN NOREN·Filed 2010·Granted May 31, 2016·2 cites·20 claims
- 1173US8361827B2Assembly techniques for solar cell arrays and solar cells formed therefromMICROLINK DEVICES INC·Filed 2010·Granted Jan 29, 2013·1 cites·13 claims
- 1272US7130124B2Average pitch gratings for optical filtering applicationsTRI QUINT SEMICONDUCTOR INC·Filed 2003·Granted Oct 31, 2006·11 cites·26 claims
- 1370US11901476B2Methods for fabricating thin film III-V compound solar cellMICROLINK DEVICES INC·Filed 2021·Granted Feb 13, 2024·0 cites·14 claims
- 1467US10214295B2High-efficiency, lightweight solar sheetsMICROLINK DEVICES INC·Filed 2017·Granted Feb 26, 2019·1 cites·20 claims
- 1565US2013133730A1Thin film inp-based solar cells using epitaxial lift-offMICROLINK DEVICES INC·Filed 2013·Application pending·0 cites
- 1664US8426237B2Assembly techniques for solar cell arrays and solar cells formed therefromMICROLINK DEVICES INC·Filed 2012·Granted Apr 23, 2013·0 cites·4 claims
- 1764US2015255668A1Thin film inp-based solar cells using epitaxial lift-offMICROLINK DEVICES INC·Filed 2012·Application pending·0 cites
- 1860US2025338635A1Mosaic coverglass for space power modulesMICROLINK DEVICES INC·Filed 2025·Application pending·0 cites
- 1960US2021323689A1High-efficiency, lightweight solar sheetsMICROLINK DEVICES INC·Filed 2021·Application pending·0 cites
- 2058US2023174254A1Solar sheets with improved light coupling and methods for their manufacture and useMICROLINK DEVICES INC·Filed 2022·Application pending·0 cites
- 2157US10685843B2Deep photoenhanced wet material etching using high-power ultraviolet light emitting diodesMICROLINK DEVICES INC·Filed 2018·Granted Jun 16, 2020·0 cites·25 claims
- 2257US2012227798A1High efficiency group iii-v compound semiconductor solar cell with oxidized window layerPAN NOREN·Filed 2012·Application pending·0 cites
- 2353US2024363783A1Flexible space solar sheets and methods for their manufacture and useMICROLINK DEVICES INC·Filed 2024·Application pending·0 cites
- 2449US2019322376A1High-efficiency, lightweight solar sheetsMICROLINK DEVICES INC·Filed 2019·Application pending·0 cites
- 2547US10522363B2Systems and methods for perforation and ohmic contact formation for GaN epitaxial lift-off using an etch stop layerMICROLINK DEVICES INC·Filed 2018·Granted Dec 31, 2019·0 cites·30 claims
- 2643US2013082239A1Light emitting diode fabricated by epitaxial lift-offMICROLINK DEVICES INC·Filed 2012·Application pending·0 cites
- 2736US11398575B2Back-contact thin film semiconductor device structures and methods for their productionMICROLINK DEVICES INC·Filed 2018·Granted Jul 26, 2022·0 cites·15 claims
- 2827US2001025826A1Dense-plasma etching of InP-based materials using chlorine and nitrogenFiled 2001·Application pending·0 cites
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