Inventor · disambiguated record
Po-Shing Chiang
Also filed as: CHIANG PO-SHING
5 granted patents·1 pending application·78 citations·filing 2009–2013
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0189US8106492B2Semiconductor package and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2009·Granted Jan 31, 2012·25 cites·21 claims
- 0288US8124447B2Manufacturing method of advanced quad flat non-leaded packageCHANG CHIEN PAO-HUEI·Filed 2009·Granted Feb 28, 2012·24 cites·29 claims
- 0387US8237250B2Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2009·Granted Aug 7, 2012·21 cites·20 claims
- 0481US8502363B2Semiconductor device packages with solder joint enhancement element and related methodsCHIANG PO-SHING·Filed 2012·Granted Aug 6, 2013·8 cites·20 claims
- 0551US8994156B2Semiconductor device packages with solder joint enhancement elementsADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Mar 31, 2015·0 cites·16 claims
- 0635US2012119342A1Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →