Inventor · disambiguated record
Kiyoshi Demizu
Also filed as: DEMIZU KIYOSHI
5 granted patents·125 citations·filing 1997–2005
83Inventor score
Top patents by PatentIndex Score
5 records- 0191US7315064B2Bonded wafer and method of producing bonded waferSHINETSU HANDOTAI KK·Filed 2005·Granted Jan 1, 2008·20 cites·5 claims
- 0289US7052974B2Bonded wafer and method of producing bonded waferSHINETSU HANDOTAI KK·Filed 2002·Granted May 30, 2006·47 cites·16 claims
- 0375US7411274B2Silicon semiconductor substrate and its manufacturing methodSHINETSU HANDOTAI KK·Filed 2004·Granted Aug 12, 2008·17 cites·11 claims
- 0469US6787797B2Semiconductor wafer and device for semiconductor device manufacturing processSHINETSU HANDOTAI KK·Filed 2001·Granted Sep 7, 2004·12 cites·19 claims
- 0563US6131052ASemiconductor manufacturing non-processing apparatuses with storage equipmentMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Oct 10, 2000·29 cites·18 claims
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