Inventor · disambiguated record
Hermann Vilsmeier
Also filed as: VILSMEIER HERMANN
12 granted patents·1 pending application·132 citations·filing 2004–2008
89Inventor score
Top patents by PatentIndex Score
13 records- 0189US7420262B2Electronic component and semiconductor wafer, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 2, 2008·52 cites·9 claims
- 0282US7944061B2Semiconductor device having through contacts through a plastic housing composition and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 17, 2011·10 cites·10 claims
- 0382US7091595B2Semiconductor device with semiconductor chip and rewiring layer and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 15, 2006·29 cites·8 claims
- 0479US7009288B2Semiconductor component with electromagnetic shielding deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 7, 2006·31 cites·16 claims
- 0573US7883993B2Semiconductor device with semiconductor chip and rewiring layer and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 8, 2011·5 cites·13 claims
- 0662US8580070B2Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor waferFUERGUT EDWARD·Filed 2005·Granted Nov 12, 2013·2 cites·19 claims
- 0761US7663218B2Integrated circuit component with a surface-mount housingINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 16, 2010·1 cites·9 claims
- 0858US7999362B2Method and apparatus for making semiconductor devices including a foilINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 16, 2011·1 cites·12 claims
- 0957US7713791B2Panel and semiconductor device having a composite plate with semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 11, 2010·1 cites·17 claims
- 1049US7772105B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 10, 2010·0 cites·8 claims
- 1146US7327023B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 5, 2008·0 cites·12 claims
- 1238US7709379B2Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 4, 2010·0 cites·6 claims
- 1335US2006157849A1Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereofGOLLER BERND·Filed 2006·Application pending·0 cites
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