Inventor · disambiguated record
Uwe Seidel
Also filed as: SEIDEL UWE
25 granted patents·1 pending application·232 citations·filing 1995–2024
95Inventor score
Files withINFINEON TECHNOLOGIES AG12INFINEON TECH DRESDEN GMBH & CO KG3SEIDEL UWE3BAKALSKI WINFRIED1BETTINESCHI GABRIELE1
Top patents by PatentIndex Score
26 records- 0196US9659877B2Shielding deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 23, 2017·29 cites·16 claims
- 0295US8461655B2Micromechanical sound transducer having a membrane support with tapered surfaceKLEIN WOLFGANG·Filed 2011·Granted Jun 11, 2013·30 cites·26 claims
- 0395US7772123B2Through substrate via semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 10, 2010·41 cites·21 claims
- 0493US8399936B2Through substrate via semiconductor componentsBIRNER ALBERT·Filed 2010·Granted Mar 19, 2013·19 cites·25 claims
- 0588US7999358B2Shielding deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 16, 2011·14 cites·23 claims
- 0687US8513782B2Shielding deviceBAKALSKI WINFRIED·Filed 2011·Granted Aug 20, 2013·8 cites·20 claims
- 0785US7176128B2Method for fabrication of a contact structureINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 13, 2007·40 cites·23 claims
- 0881US12362191B2Methods and devices related to radio frequency devicesINFINEON TECH DRESDEN GMBH & CO KG·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0981US8227340B2Method for producing a copper connection between two sides of a substrateSEIDEL UWE·Filed 2009·Granted Jul 24, 2012·14 cites·19 claims
- 1079US2025029884A1Method of Manufacturing a Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic ComponentINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1178US12112992B2Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic componentINFINEON TECHNOLOGIES AG·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 1273US8697574B2Through substrate features in semiconductor substratesMACKH GUNTHER·Filed 2009·Granted Apr 15, 2014·5 cites·25 claims
- 1372US11948802B2Methods and devices related to radio frequency devicesINFINEON TECH DRESDEN GMBH & CO KG·Filed 2021·Granted Apr 2, 2024·0 cites·14 claims
- 1472US8815743B2Through substrate via semiconductor components and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 26, 2014·2 cites·14 claims
- 1571US11605572B2Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 14, 2023·0 cites·23 claims
- 1670US10615029B2Device and method for manufacturing the deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 7, 2020·1 cites·17 claims
- 1769US10800201B2Security object having a dynamic and static window security feature and method for productionBUNDESDRUCKEREI GMBH·Filed 2017·Granted Oct 13, 2020·1 cites·17 claims
- 1868US11217453B2Methods and devices related to radio frequency devicesINFINEON TECH DRESDEN GMBH & CO KG·Filed 2020·Granted Jan 4, 2022·0 cites·12 claims
- 1965US9159620B2Semiconductor structure and method for making sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Oct 13, 2015·1 cites·13 claims
- 2059USD659718SFront cover of a pumpSEIDEL UWE·Filed 2011·Granted May 15, 2012·9 cites·1 claims
- 2158US8822329B2Method for making conductive interconnectsLEUSCHNER RAINER·Filed 2009·Granted Sep 2, 2014·1 cites·23 claims
- 2253USD659715SFront cover of a pumpSEIDEL UWE·Filed 2011·Granted May 15, 2012·7 cites·1 claims
- 2352US9165828B2Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Oct 20, 2015·0 cites·13 claims
- 2448US7395587B2Apparatus for controlling a compression zone in a compressively shrinking fabric webCATALLO FRANK·Filed 2004·Granted Jul 8, 2008·0 cites·21 claims
- 2543US6380094B1Method for preventing redeposition of etching products onto substrate surfaces during a tungsten re-etching process in the production of LSI circuitsINFINEON TECHNOLOGIES AG·Filed 1995·Granted Apr 30, 2002·10 cites·7 claims
- 2640US8659118B2Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor deviceBETTINESCHI GABRIELE·Filed 2011·Granted Feb 25, 2014·0 cites·22 claims
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