Inventor · disambiguated record
Masayuki Miyaji
Also filed as: MIYAJI MASAYUKI
17 granted patents·8 pending applications·376 citations·filing 1997–2025
94Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD14SHOWA DENKO MATERIALS CO LTD5RESONAC CORP3HITACHI LTD1NUVOTON TECHNOLOGY CORP JAPAN1
Top patents by PatentIndex Score
25 records- 0191US6326845B1Feedforward amplifierMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 4, 2001·63 cites·12 claims
- 0291US6201439B1Power splitter/ combiner circuit, high power amplifier and balun circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Mar 13, 2001·44 cites·2 claims
- 0388US6847258B2Power amplifier, power amplifying method and radio communication apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 25, 2005·52 cites·28 claims
- 0488US6803837B2Power splitter/combiner circuit, high power amplifier and balun circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 12, 2004·18 cites·2 claims
- 0585US6545542B2Power amplifier with coupler for cross-coupling amplifiers for reduction of differential frequency componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 8, 2003·37 cites·24 claims
- 0685US5973557AHigh efficiency linear power amplifier of plural frequency bands and high efficiency power amplifierMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Oct 26, 1999·86 cites·23 claims
- 0780US2025392264A1Radio frequency power amplifierNUVOTON TECHNOLOGY CORP JAPAN·Filed 2025·Application pending·0 cites
- 0878US12246398B2Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bumpSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Mar 11, 2025·1 cites·8 claims
- 0969US2025083262A1Solder particles and method for producing solder particlesRESONAC CORP·Filed 2024·Application pending·0 cites
- 1067US6710652B2Feedforward amplifierMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 23, 2004·15 cites·18 claims
- 1167US6563395B2Power splitter/combiner circuit, high power amplifier and balun circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 13, 2003·5 cites·4 claims
- 1265US12172240B2Solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·11 claims
- 1363US6690249B2Power splitter/combiner multi-layer circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 10, 2004·4 cites·2 claims
- 1462US2025205799A1Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bumpRESONAC CORP·Filed 2025·Application pending·0 cites
- 1561US2024209182A1Hardener, adhesive composition, adhesive film for circuit connection, connected structure, and method for producing connected structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 1660US6300848B1Power splitter and power combiner using N-branch-line-shaped directional couplersMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Oct 9, 2001·14 cites·18 claims
- 1756US12247270B2Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recessesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 11, 2025·0 cites·12 claims
- 1851US6037837AFeed forward amplifierMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Mar 14, 2000·13 cites·20 claims
- 1950US12100923B2Connection structure and manufacturing method thereforSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 24, 2024·0 cites·6 claims
- 2050US2021229222A1Solder particles and method for producing solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 2147US6940346B2Feedforward amplifier, communication apparatus, feedforward amplification method, program and mediumMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 6, 2005·5 cites·33 claims
- 2246US2023058249A1On-vehicle control deviceHITACHI LTD·Filed 2020·Application pending·0 cites
- 2345US6590906B1Multi-carrier transmitter circuit and communication equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 8, 2003·19 cites·21 claims
- 2439US2004061568A1Power splitter/combiner circuit, high power amplifier and balun circuitFiled 2003·Application pending·0 cites
- 2537US2006076673A1Power amplifier moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →