Inventor · disambiguated record
Tsorng-Dih Yuan
Also filed as: YUAN TSORNG D · YUAN TSORNG-DIH
16 granted patents·7 pending applications·594 citations·filing 1992–2010
95Inventor score
Top patents by PatentIndex Score
23 records- 0195US6337513B1Chip packaging system and method using deposited diamond filmIBM·Filed 1999·Granted Jan 8, 2002·188 cites·17 claims
- 0292US7052937B2Method and structure for providing improved thermal conduction for silicon semiconductor devicesIBM·Filed 2003·Granted May 30, 2006·64 cites·13 claims
- 0391US7514775B2Stacked structures and methods of fabricating stacked structuresTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 7, 2009·24 cites·21 claims
- 0490US8466486B2Thermal management system for multiple heat source devicesYUAN TSORNG-DIH·Filed 2010·Granted Jun 18, 2013·15 cites·20 claims
- 0590US8247900B2Flip chip package having enhanced thermal and mechanical performanceYUAN TSORNG-DIH·Filed 2009·Granted Aug 21, 2012·23 cites·20 claims
- 0687US6778393B2Cooling device with multiple compliant elementsIBM·Filed 2002·Granted Aug 17, 2004·48 cites·20 claims
- 0785US7135769B2Semiconductor packages and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 14, 2006·12 cites·9 claims
- 0883US5276338ABonded wafer structure having a buried insulation layerIBM·Filed 1992·Granted Jan 4, 1994·68 cites·18 claims
- 0982US6617702B2Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrateIBM·Filed 2001·Granted Sep 9, 2003·33 cites·34 claims
- 1080US7361986B2Heat stud for stacked chip packageTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 22, 2008·28 cites·14 claims
- 1179US5366923ABonded wafer structure having a buried insulation layerIBM·Filed 1993·Granted Nov 22, 1994·54 cites·22 claims
- 1271US7348218B2Semiconductor packages and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 25, 2008·4 cites·20 claims
- 1367US7134484B2Increased efficiency in liquid and gaseous planar device cooling technologyIBM·Filed 2000·Granted Nov 14, 2006·14 cites·1 claims
- 1463US6579743B2Chip packaging system and method using deposited diamond filmIBM·Filed 2002·Granted Jun 17, 2003·15 cites·14 claims
- 1548US7138300B2Structural design for flip-chip assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 21, 2006·3 cites·12 claims
- 1645US7329600B2Low dielectric semiconductor device and process for fabricating the sameIBM·Filed 2004·Granted Feb 12, 2008·1 cites·23 claims
- 1741US2006170088A1Spacer Structures for Semiconductor Package DevicesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1840US2006261469A1Sealing membrane for thermal interface materialTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1939US2006118947A1Thermal expansion compensating flip chip ball grid array package structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 2039US2006118969A1Flip chip ball grid array package assemblies and electronic devices with heat dissipation capabilityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 2138US2005017350A1Thermal enhanced extended surface tape for integrated circuit heat dissipationIBM·Filed 2004·Application pending·0 cites
- 2237US2006060952A1Heat spreader for non-uniform power dissipationYUAN TSORNG-DIH·Filed 2004·Application pending·0 cites
- 2335US2002195228A1Thermal enhanced extended surface tape for integrated circuit heat dissipationIBM·Filed 2001·Application pending·0 cites
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