Inventor · disambiguated record
Chia-Ao Chang
Also filed as: CHANG CHIA-AO
9 granted patents·1 pending application·4 citations·filing 2017–2023
79Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10
Top patents by PatentIndex Score
10 records- 0182US10504747B2Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bendingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·2 cites·20 claims
- 0281US12183590B2Method of performing gap filling including filling trenches between dummy gate stacks on semiconductor fins/strips with semiconductor materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0377US11605543B2Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bendingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 14, 2023·0 cites·20 claims
- 0474US11211470B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·1 cites·20 claims
- 0571US2023387273A1System and methods of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0669US12087845B2System and methods of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 0766US11289343B2Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bendingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·0 cites·20 claims
- 0863US10115639B2FinFET device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 30, 2018·1 cites·20 claims
- 0955US11710777B2Semiconductor device and method for manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 25, 2023·0 cites·20 claims
- 1046US11205709B2Defect filling in patterned layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 21, 2021·0 cites·20 claims
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