Inventor · disambiguated record
Ching-Shun Huang
Also filed as: HUANG CHING-SHUN
1 granted patent·3 pending applications·32 citations·filing 2006–2007
45Inventor score
Technology areasH10W
Files withADVANCED CHIP ENG TECH INC4
Top patents by PatentIndex Score
4 records- 0191US7453148B2Structure of dielectric layers in built-up layers of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2006·Granted Nov 18, 2008·32 cites·18 claims
- 0240US2008197469A1Multi-chips package with reduced structure and method for forming the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 0340US2008136004A1Multi-chip package structure and method of forming the sameADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 0438US2008088004A1Wafer level package structure with build up layersADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
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