Inventor · disambiguated record
Der-Yuan Wu
Also filed as: WU DER Y · WU DER-YUAN
33 granted patents·5 pending applications·558 citations·filing 1993–2003
98Inventor score
Files withUNITED MICROELECTRONICS CORP32
Top patents by PatentIndex Score
38 records- 0185US6392924B1Array for forming magnetoresistive random access memory with pseudo spin valveUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 21, 2002·39 cites·22 claims
- 0282US5703408ABonding pad structure and method thereofUNITED MICROELECTRONICS CORP·Filed 1995·Granted Dec 30, 1997·73 cites·20 claims
- 0377US6432768B1Method of fabricating memory device and logic device on the same chipUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 13, 2002·23 cites·18 claims
- 0477US6399495B1Copper interconnections for metal-insulator-metal capacitor in mixed mode signal processFiled 2000·Granted Jun 4, 2002·39 cites·21 claims
- 0577US6281069B1Method for forming deep trench capacitor under a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 28, 2001·19 cites·12 claims
- 0673US6406974B1Method of forming triple N well utilizing phosphorus and boron ion implantationsUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jun 18, 2002·25 cites·10 claims
- 0773US6096642AMethod of forming self-aligned silicide in integrated circuit without causing bridging effectsUNITED MICROELECTRONICS CORP·Filed 1998·Granted Aug 1, 2000·34 cites·20 claims
- 0869US5795805AFabricating method of dynamic random access memoryUNITED MICROELECTRONICS CORP·Filed 1997·Granted Aug 18, 1998·26 cites·11 claims
- 0968US6753244B2Method for manufacturing a copper fuse structureUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jun 22, 2004·13 cites·8 claims
- 1067US5913129AMethod of fabricating a capacitor structure for a dynamic random access memoryUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jun 15, 1999·27 cites·16 claims
- 1166US6261898B1Method for fabricating a salicide gateUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jul 17, 2001·13 cites·10 claims
- 1265US6040231AMethod of fabricating a shallow trench isolation structure which includes using a salicide process to form an aslope periphery at the top corner of the substrateUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 21, 2000·31 cites·47 claims
- 1364US6204109B1Method for forming a cylindrical capacitorUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 20, 2001·22 cites·10 claims
- 1461US6140201AMethod for fabricating a cylinder capacitorUNITED MICROELECTRONICS CORP·Filed 1998·Granted Oct 31, 2000·26 cites·16 claims
- 1561US6121085AMethod of fabricating contact openings for dynamic random-access memoryUNITED MICROELECTRONICS CORP·Filed 1998·Granted Sep 19, 2000·18 cites·13 claims
- 1659US5930623AMethod of forming a data storage capacitor with a wide electrode area for dynamic random access memory using double spacersUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jul 27, 1999·17 cites·16 claims
- 1756US6833318B2Gap-filling processUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 21, 2004·8 cites·13 claims
- 1855US6746883B2Direct determination of interface traps in MOS devicesUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jun 8, 2004·7 cites·8 claims
- 1955US5739046AMethod of making a reliable barrier layerUNITED MICROELECTRONICS CORP·Filed 1996·Granted Apr 14, 1998·17 cites·41 claims
- 2051US5854106AMethod of forming a data storage capacitor with a wide electrode area for dynamic random access memoryUNITED MICROELECTRONICS CORP·Filed 1998·Granted Dec 29, 1998·11 cites·17 claims
- 2149US6030867AMethod of fabricating a Fin/HSG DRAM cell capacitorUNITED MICROELECTRONICS CORP·Filed 1997·Granted Feb 29, 2000·16 cites·24 claims
- 2244US6667534B1Copper fuse structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 23, 2003·1 cites·12 claims
- 2343US5599746AMethod to eliminate polycide peeling at wafer edge using extended scribe linesUNITED MICROELECTRONICS CORP·Filed 1994·Granted Feb 4, 1997·12 cites·5 claims
- 2439US6103606AMethod of fabricating a word lineUNITED MICROELECTRONICS CORP·Filed 1996·Granted Aug 15, 2000·8 cites·9 claims
- 2539US5937307AProcess for fabricating DRAM capacitorUNITED MICROELECTRONICS CORP·Filed 1998·Granted Aug 10, 1999·6 cites·15 claims
- 2638US6004845AMethod for fabricating a crown-shaped capacitorUNITED MICROELECTRONICS CORP·Filed 1998·Granted Dec 21, 1999·4 cites·39 claims
- 2738US2002146887A1Method for forming magnetoresistive random access memory with magnetic tunnelling junctionFiled 2001·Application pending·0 cites
- 2837US6017799AMethod of fabricating dynamic random memoryUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 25, 2000·4 cites·22 claims
- 2937US5391519AMethod for increasing pad bonding of an IC (1)UNITED MICROELECTRONICS CORP·Filed 1993·Granted Feb 21, 1995·9 cites·6 claims
- 3036US2002102813A1Method for manufacturing semiconductor device on silicon-on-insulator substrateFiled 2001·Application pending·0 cites
- 3135US2002106880A1Method for avoiding the junction leakageFiled 2001·Application pending·0 cites
- 3234US2002164871A1Method for manufacturing a trench DRAMFiled 2001·Application pending·0 cites
- 3333US6080666AMethod for increasing landing pad areaUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 27, 2000·4 cites·10 claims
- 3433US5668393ALocos technology with reduced junction leakageUNITED MICROELECTRONICS CORP·Filed 1996·Granted Sep 16, 1997·3 cites·7 claims
- 3532US2002061610A1Method for fabricating embedded dynamic random access memoryFiled 2000·Application pending·0 cites
- 3631US6124166AMethod of forming a lower electrode of a capacitor in a DRAM cellUNITED MICROELECTRONICS CORP·Filed 1999·Granted Sep 26, 2000·1 cites·6 claims
- 3731US6110827APlanarization method for self-aligned contact processUNITED MICROELECTRONICS CORP·Filed 1996·Granted Aug 29, 2000·2 cites·27 claims
- 3829US6051507AMethod of fabricating capacitor with high capacitanceUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 18, 2000·0 cites·10 claims
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