Inventor · disambiguated record
Jian-Ting Chen
Also filed as: CHEN JIAN · Chen jian-ting
13 granted patents·5 pending applications·33 citations·filing 2008–2025
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6WINBOND ELECTRONICS CORP6Chen jian-ting2ACER INC1CHEN YU-HAN1
Top patents by PatentIndex Score
18 records- 0192US11693025B2Testing apparatus and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·20 claims
- 0290US12085627B2Test apparatus and method for testing cable assemblyTYCO ELECTRONICS SUZHOU LTD·Filed 2022·Granted Sep 10, 2024·4 cites·27 claims
- 0384US2025365851A1Semiconductor package assembly and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0479US2024345130A1Testing apparatus and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0577US8285355B2Biomedical electric wave sensorCHEN YU-HAN·Filed 2010·Granted Oct 9, 2012·12 cites·15 claims
- 0676US12066457B2Testing apparatus and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0775US12477647B2Semiconductor package assembly and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0873US8144132B2Multipoint sensing method for capacitive touch panelCHEN JIAN TING·Filed 2008·Granted Mar 27, 2012·9 cites·17 claims
- 0969US11778727B2Semiconductor package assembly and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1067US8134541B2Capacitive touch panelChen jian-ting·Filed 2009·Granted Mar 13, 2012·6 cites·14 claims
- 1165US11805644B2Manufacturing method of memory deviceWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 31, 2023·0 cites·17 claims
- 1258US2025079315A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1356US11257833B2Memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 22, 2022·0 cites·6 claims
- 1449US11251273B2Non-volatile memory device and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 15, 2022·0 cites·12 claims
- 1547US12040412B2Semiconductor device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jul 16, 2024·0 cites·12 claims
- 1645US11362098B2Method for manufacturing memory deviceWINBOND ELECTRONICS CORP·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 1740US2021232725A1System and method for testing an integrated monitoring systemELECTRIC POWER SCIENCE & RES INSTITUTE OF STATE GRID TIANJN ELECTRIC POWER COMPANY·Filed 2018·Application pending·0 cites
- 1835US2011267303A1Capacitive touch panelACER INC·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →