Inventor · disambiguated record
Yoshiteru Nishida
Also filed as: NISHIDA YOSHITERU
9 granted patents·3 pending applications·7 citations·filing 2012–2024
77Inventor score
Technology areasH10P
Top patents by PatentIndex Score
12 records- 0179US9330976B2Wafer processing methodDISCO CORP·Filed 2015·Granted May 3, 2016·4 cites·3 claims
- 0275US10177004B2Method of processing waferDISCO CORP·Filed 2018·Granted Jan 8, 2019·2 cites·6 claims
- 0363US10115636B2Processing method for workpieceDISCO CORP·Filed 2015·Granted Oct 30, 2018·1 cites·3 claims
- 0458US2025118561A1Workpiece processing methodDISCO CORP·Filed 2024·Application pending·0 cites
- 0555US2024030068A1Processing method of workpieceDISCO CORP·Filed 2023·Application pending·0 cites
- 0653US12094776B2Wafer processing methodDISCO CORP·Filed 2021·Granted Sep 17, 2024·0 cites·10 claims
- 0744US11456213B2Processing method of waferDISCO CORP·Filed 2020·Granted Sep 27, 2022·0 cites·3 claims
- 0844US10957593B2Method of processing a waferDISCO CORP·Filed 2019·Granted Mar 23, 2021·0 cites·7 claims
- 0943US10790193B2Wafer processing methodDISCO CORP·Filed 2019·Granted Sep 29, 2020·0 cites·4 claims
- 1042US10896836B2Electrostatic chuckDISCO CORP·Filed 2018·Granted Jan 19, 2021·0 cites·8 claims
- 1142US10790192B2Wafer processing methodDISCO CORP·Filed 2019·Granted Sep 29, 2020·0 cites·4 claims
- 1234US2012252212A1Processing method for wafer having embedded electrodesNISHIDA YOSHITERU·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →