Inventor · disambiguated record
Katsuhiko Horigome
Also filed as: HORIGOME KATSUHIKO
8 granted patents·1 pending application·16 citations·filing 2002–2021
79Inventor score
Files withLINTEC CORP9
Top patents by PatentIndex Score
9 records- 0187US10460973B2Adhesive tape for semiconductor processing and method for producing semiconductor deviceLINTEC CORP·Filed 2017·Granted Oct 29, 2019·7 cites·20 claims
- 0261US7105226B2Pressure sensitive adhesive double coated sheet and method of use thereofLINTEC CORP·Filed 2002·Granted Sep 12, 2006·8 cites·4 claims
- 0356US11183416B2Adhesive tape for semiconductor processing, and semiconductor device manufacturing methodLINTEC CORP·Filed 2017·Granted Nov 23, 2021·0 cites·15 claims
- 0456US10879104B2Adhesive tape for semiconductor processing and method for producing semiconductor deviceLINTEC CORP·Filed 2019·Granted Dec 29, 2020·0 cites·15 claims
- 0548US12408551B2Thermoelectric conversion moduleLINTEC CORP·Filed 2021·Granted Sep 2, 2025·0 cites·9 claims
- 0645US7361971B2Semiconductor wafer protection structure and laminated protective sheet for use thereinLINTEC CORP·Filed 2003·Granted Apr 22, 2008·1 cites·5 claims
- 0741US10825790B2Protective film for semiconductors, semiconductor device, and composite sheetLINTEC CORP·Filed 2016·Granted Nov 3, 2020·0 cites·8 claims
- 0840US10086594B2Sheet having adhesive resin layer attached thereto, and method for producing semiconductor deviceLINTEC CORP·Filed 2013·Granted Oct 2, 2018·0 cites·13 claims
- 0938US2006134406A1Pressure sensitive adhesive sheet, method of protecting semiconductor wafer surface and method of processing workLINTEC CORP·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →