Inventor · disambiguated record
Francois J. Henley
Also filed as: HENLEY FRANCOIS · HENLEY FRANCOIS J
151 granted patents·33 pending applications·11,594 citations·filing 1983–2020
99Inventor score
Top patents by PatentIndex Score
184 records- 0199US7674687B2Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving processSILICON GENESIS CORP·Filed 2005·Granted Mar 9, 2010·300 cites·18 claims
- 0299US7371660B2Controlled cleaving processSILICON GENESIS CORP·Filed 2005·Granted May 13, 2008·289 cites·56 claims
- 0399US7351644B2Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer processSILICON GENESIS CORP·Filed 2006·Granted Apr 1, 2008·290 cites·25 claims
- 0499US7166520B1Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer processSILICON GENESIS CORP·Filed 2005·Granted Jan 23, 2007·385 cites·35 claims
- 0599US6790747B2Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2002·Granted Sep 14, 2004·239 cites·24 claims
- 0699US6632724B2Controlled cleaving processSILICON GENESIS CORP·Filed 2000·Granted Oct 14, 2003·163 cites·31 claims
- 0799US6528391B1Controlled cleavage process and device for patterned filmsSILICON GENESIS CORP·Filed 1999·Granted Mar 4, 2003·422 cites·22 claims
- 0899US6146979APressurized microbubble thin film separation process using a reusable substrateSILICON GENESIS CORP·Filed 1998·Granted Nov 14, 2000·292 cites·10 claims
- 0999US6048411ASilicon-on-silicon hybrid wafer assemblySILICON GENESIS CORP·Filed 1998·Granted Apr 11, 2000·266 cites·11 claims
- 1099US6033974AMethod for controlled cleaving processSILICON GENESIS CORP·Filed 1999·Granted Mar 7, 2000·386 cites·20 claims
- 1199US6013563AControlled cleaning processSILICON GENESIS CORP·Filed 1998·Granted Jan 11, 2000·330 cites·48 claims
- 1299US6010579AReusable substrate for thin film separationSILICON GENESIS CORP·Filed 1998·Granted Jan 4, 2000·254 cites·15 claims
- 1399US5985742AControlled cleavage process and device for patterned filmsSILICON GENESIS CORP·Filed 1998·Granted Nov 16, 1999·493 cites·22 claims
- 1498US7759220B2Method and structure for fabricating solar cells using a layer transfer processSILICON GENESIS CORP·Filed 2007·Granted Jul 20, 2010·61 cites·25 claims
- 1598US6548382B1Gettering technique for wafers made using a controlled cleaving processSILICON GENESIS CORP·Filed 2000·Granted Apr 15, 2003·162 cites·20 claims
- 1698US6458672B1Controlled cleavage process and resulting device using beta annealingSILICON GENESIS CORP·Filed 2000·Granted Oct 1, 2002·84 cites·56 claims
- 1798US6391740B1Generic layer transfer methodology by controlled cleavage processSILICON GENESIS CORP·Filed 1999·Granted May 21, 2002·163 cites·20 claims
- 1898US6321134B1Clustertool system software using plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Nov 20, 2001·357 cites·23 claims
- 1998US6184111B1Pre-semiconductor process implant and post-process film separationSILICON GENESIS CORP·Filed 1999·Granted Feb 6, 2001·251 cites·7 claims
- 2098US6159824ASilicon-on-silicon wafer bonding process using a thin film blister-separation methodSILICON GENESIS CORP·Filed 1998·Granted Dec 12, 2000·188 cites·8 claims
- 2198US6013567AControlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 1999·Granted Jan 11, 2000·154 cites·4 claims
- 2298US5994207AControlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 1998·Granted Nov 30, 1999·244 cites·24 claims
- 2397US7160790B2Controlled cleaving processSILICON GENESIS CORP·Filed 2003·Granted Jan 9, 2007·70 cites·39 claims
- 2497US7056808B2Cleaving process to fabricate multilayered substrates using low implantation dosesSILICON GENESIS CORP·Filed 2002·Granted Jun 6, 2006·121 cites·16 claims
- 2597US6511899B1Controlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 1999·Granted Jan 28, 2003·133 cites·11 claims
- 2697US6486041B2Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2001·Granted Nov 26, 2002·124 cites·20 claims
- 2797US6448152B1Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customerSILICON GENESIS CORP·Filed 2001·Granted Sep 10, 2002·149 cites·29 claims
- 2897US6290804B1Controlled cleavage process using patterningSILICON GENESIS CORP·Filed 1998·Granted Sep 18, 2001·121 cites·67 claims
- 2997US6245161B1Economical silicon-on-silicon hybrid wafer assemblySILICON GENESIS CORP·Filed 1998·Granted Jun 12, 2001·127 cites·20 claims
- 3097US6207005B1Cluster tool apparatus using plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Mar 27, 2001·209 cites·18 claims
- 3197US6187110B1Device for patterned filmsSILICON GENESIS CORP·Filed 1999·Granted Feb 13, 2001·123 cites·1 claims
- 3297US6083324AGettering technique for silicon-on-insulator wafersSILICON GENESIS CORP·Filed 1998·Granted Jul 4, 2000·252 cites·26 claims
- 3396US8071463B2Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving processHENLEY FRANCOIS J·Filed 2010·Granted Dec 6, 2011·19 cites·26 claims
- 3496US7811900B2Method and structure for fabricating solar cells using a thick layer transfer processSILICON GENESIS CORP·Filed 2007·Granted Oct 12, 2010·32 cites·59 claims
- 3596US6558802B1Silicon-on-silicon hybrid wafer assemblySILICON GENESIS CORP·Filed 2000·Granted May 6, 2003·59 cites·18 claims
- 3696US6335264B1Controlled cleavage thin film separation process using a reusable substrateSILICON GENESIS CORP·Filed 2000·Granted Jan 1, 2002·60 cites·17 claims
- 3796US6284631B1Method and device for controlled cleaving processSILICON GENESIS CORP·Filed 2000·Granted Sep 4, 2001·86 cites·17 claims
- 3896US6162705AControlled cleavage process and resulting device using beta annealingSILICON GENESIS CORP·Filed 1998·Granted Dec 19, 2000·113 cites·52 claims
- 3996US6153524ACluster tool method using plasma immersion ion implantationSILICON GENESIS CORP·Filed 1998·Granted Nov 28, 2000·150 cites·73 claims
- 4095US8012851B2Method and structure for fabricating solar cellsSILICON GENESIS CORP·Filed 2010·Granted Sep 6, 2011·15 cites·7 claims
- 4195US7911016B2Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving processSILICON GENESIS CORP·Filed 2010·Granted Mar 22, 2011·14 cites·24 claims
- 4295US7479441B2Method and apparatus for flag-less water bonding toolSILICON GENESIS CORP·Filed 2006·Granted Jan 20, 2009·43 cites·39 claims
- 4395US7427554B2Manufacturing strained silicon substrates using a backing materialSILICON GENESIS CORP·Filed 2005·Granted Sep 23, 2008·47 cites·16 claims
- 4495US7094666B2Method and system for fabricating strained layers for the manufacture of integrated circuitsSILICON GENESIS CORP·Filed 2005·Granted Aug 22, 2006·34 cites·32 claims
- 4595US6890838B2Gettering technique for wafers made using a controlled cleaving processSILICON GENESIS CORP·Filed 2003·Granted May 10, 2005·71 cites·20 claims
- 4695US6582999B2Controlled cleavage process using pressurized fluidSILICON GENESIS CORP·Filed 2001·Granted Jun 24, 2003·109 cites·25 claims
- 4795US6155909AControlled cleavage system using pressurized fluidSILICON GENESIS CORP·Filed 1998·Granted Dec 5, 2000·80 cites·28 claims
- 4895US6103599APlanarizing technique for multilayered substratesSILICON GENESIS CORP·Filed 1998·Granted Aug 15, 2000·206 cites·28 claims
- 4995US4588950ATest system for VLSI digital circuit and method of testingDATA PROBE CORP·Filed 1983·Granted May 13, 1986·112 cites·7 claims
- 5094US8153513B2Method and system for continuous large-area scanning implantation processHENLEY FRANCOIS J·Filed 2007·Granted Apr 10, 2012·24 cites·31 claims
Showing the top 50 of 184 patent records by PatentIndex Score.
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