Inventor · disambiguated record
Laurence Singleton
Also filed as: SINGLETON LAURENCE · SINGLETON LAURENCE E · SINGLETON LAURENCE EDWARD
6 granted patents·5 pending applications·32 citations·filing 2005–2021
79Inventor score
Top patents by PatentIndex Score
11 records- 0192US11300467B2Differential pressure sensor with RFID tagSMARTRAC INVEST B V·Filed 2020·Granted Apr 12, 2022·9 cites·15 claims
- 0290US10790160B2Barrier configurations and processes in layer structuresSMARTRAC TECH GMBH·Filed 2016·Granted Sep 29, 2020·9 cites·20 claims
- 0379US7667333B2Stack of semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 23, 2010·12 cites·15 claims
- 0469US11573141B2Threshold sensor with RFID communication abilitySMARTRAC INVEST B V·Filed 2021·Granted Feb 7, 2023·0 cites·15 claims
- 0562US9978643B2Method of separating chips from a waferSMARTRAC TECH GMBH·Filed 2014·Granted May 22, 2018·1 cites·12 claims
- 0654US7772033B2Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making sameQIMONDA AG·Filed 2007·Granted Aug 10, 2010·1 cites·23 claims
- 0750US2020249109A1Threshold sensor with rfid communication abilitySMARTRAC INVEST BV·Filed 2018·Application pending·0 cites
- 0849US2018261506A1Method for Separating Chips from a WaferSMARTRAC TECH GMBH·Filed 2018·Application pending·0 cites
- 0944US2007273011A1Method for fabricating a module having an electrical contact-connectionQIMONDA AG·Filed 2007·Application pending·0 cites
- 1043US2007075122A1Method for fabricating a chip module and a device module fabricated therefromSINGLETON LAURENCE E·Filed 2005·Application pending·0 cites
- 1139US2008079150A1Die arrangement and method for producing a die arrangementSIMON JUERGEN·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →