Inventor · disambiguated record
Chen-Han Chiang
Also filed as: CHIANG CHEN-HAN
6 granted patents·19 citations·filing 2011–2014
78Inventor score
Top patents by PatentIndex Score
6 records- 0187US8409925B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2011·Granted Apr 2, 2013·8 cites·18 claims
- 0285US8673686B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2012·Granted Mar 18, 2014·7 cites·14 claims
- 0373US8779558B2Chip package structure and manufacturing method thereofXINTEC INC·Filed 2013·Granted Jul 15, 2014·2 cites·15 claims
- 0463US9165890B2Chip package comprising alignment mark and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 20, 2015·1 cites·20 claims
- 0559US8836134B2Semiconductor stacked package and method of fabricating the sameLIN PO-SHEN·Filed 2013·Granted Sep 16, 2014·1 cites·10 claims
- 0657US9054114B2Chip package structure and manufacturing method thereofXINTEC INC·Filed 2014·Granted Jun 9, 2015·0 cites·28 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →