Inventor · disambiguated record
Yuk Cheung Au
Also filed as: AU YUK CHEUNG
7 granted patents·3 pending applications·112 citations·filing 2000–2016
85Inventor score
Files withASM ASSEMBLY AUTOMATION LTD5ASM TECH SINGAPORE PTE LTD1CHAN MAN WAI1CHONG CHI MING1LIAO DAZHANG1
Top patents by PatentIndex Score
10 records- 0185US6367669B1Fluid dispensing apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2000·Granted Apr 9, 2002·36 cites·13 claims
- 0284US8470130B2Universal die detachment apparatusCHONG CHI MING·Filed 2010·Granted Jun 25, 2013·15 cites·18 claims
- 0383US8141612B2Device for thin die detachment and pick-upCHAN MAN WAI·Filed 2009·Granted Mar 27, 2012·12 cites·16 claims
- 0481US6543513B1Wafer table for die bonding apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2000·Granted Apr 8, 2003·33 cites·9 claims
- 0572US7667355B2Apparatus for generating amplified cooling air flowsASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Feb 23, 2010·7 cites·11 claims
- 0657US7240711B2Apparatus and method for alignment of a bonding toolASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Jul 10, 2007·9 cites·15 claims
- 0740US2015251195A1Fluid dispenser with self-aligning nozzleLIAO DAZHANG·Filed 2014·Application pending·0 cites
- 0832US2005034577A1Apparatus and method for indexing and severing filmASM ASSEMBLY AUTOMATION LTD·Filed 2003·Application pending·0 cites
- 0931US10475763B2Die bonding apparatus comprising an inert gas environmentASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Nov 12, 2019·0 cites·16 claims
- 1030US2003044534A1Multi-pin epoxy writing apparatusFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →