Inventor · disambiguated record
Guan-Syun Tseng
Also filed as: Tseng Guan-Syun
6 granted patents·0 citations·filing 2017–2019
63Inventor score
Files withTAIWAN UNION TECHNOLOGY CORP6
Top patents by PatentIndex Score
6 records- 0166US11008456B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted May 18, 2021·0 cites·19 claims
- 0255US11414532B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted Aug 16, 2022·0 cites·14 claims
- 0352US11339258B2Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 24, 2022·0 cites·17 claims
- 0450US10920008B2Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Feb 16, 2021·0 cites·16 claims
- 0548US11643544B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 9, 2023·0 cites·10 claims
- 0645US10563006B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Feb 18, 2020·0 cites·12 claims
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